Flat plate type micro loop heat pipe for changing capillary force of capillary core

Abstract

The invention provides a flat plate type micro loop heat pipe. The flat plate type micro loop heat pipe comprises a main plate and an upper cover plate; the upper cover plate and the main plate are packed together; the main plate comprises an evaporation chamber and a condensation chamber; a steam pipe and a liquid pipe are connected between the evaporation chamber and the condensation chamber; the evaporation chamber and the liquid pipe communicate through a capillary force channel; porous medium sheets are arranged in the evaporation chamber; and the capillary force of the porous medium sheets in different positions are gradually improved in the capillary force direction of porous medium capillary cores in the direction from the liquid pipe to the steam pipe. The capillary force of the capillary cores in different positions of the porous medium sheets is gradually improved, so that liquid can be quickly sucked to the upper part, the number of fluids at the upper part is increased; and the liquid is evaporated at the upper part to enter the steam pipe at the upper part, so that the purposes of uniform distribution of the fluids and uniform distribution of the temperature are achieved.

Description

technical field [0001] The invention belongs to the field of heat exchangers, in particular to a flat-plate miniature loop heat pipe system. Background technique [0002] With the rapid development of microelectronics and information technology, the high integration and miniaturization of devices and circuits has become an important development trend, but the increase in the heat generation intensity and temperature per unit area of ​​the chip brought about by the increase in integration will seriously threaten devices and devices. Equipment reliability. Studies have found that microelectronic chips have the characteristics of uneven surface heat distribution, and the heat flux intensity at some local hot spots can even be as high as 1000w / cm2, which is considered to be the key reason for chip failure or even damage. For this reason, the development of a micro-cooler that directly cools the chip and improves its overall temperature uniformity has become a hot spot in therma...

AI Technical Summary

Problems solved by technology

[0004] At present, in the micro-flat heat pipe of the prior art, after the capillary core porous medium is installed at the evaporation end, the fluid distribution in the steam channel is uneven, and the lower part distributes more fluid, and the upper part distributes less fluid, thus causing local heat transfer unevenness, and at the same time causing different The temperature of the steam pipe in the position is not uniform, which will cause the local temperature to be too high or too low, which will easily cause damage to the heat pipe

Images