Transferable patterned conductive thin film structure and patterning method thereof

Abstract

The invention discloses a transferable patterned conductive thin film structure and a patterning method thereof. An adhesion enhancement layer, a conductive layer and a photosensitive film layer are formed on a transfer substrate, patterning processing is performed in the case of ensuring connection stability between the conductive layer and the substrate to form a transferable conductive pattern, and finally, the conductive pattern can be transferred to a target substrate through the transfer substrate. The conductive thin film structure of the invention provides a high stability transferable conductive pattern compatible with large area mass production, provides a solution for special shape, curved and stick-on electronic devices, and has high application prospects.

Description

technical field [0001] The invention relates to the field of conductive thin films, in particular to a transferable patterned conductive thin film and a method for preparing and patterning the same. Background technique [0002] At present, in the age of electronic information, many electronic devices have penetrated into people's lives, and large-scale, flexible, bendable, and transferable electronic devices are the general trend of the development of electronic devices. Electronic touch screens are typical representatives of these electronic devices; Undoubtedly, a touch screen that satisfies the above characteristics requires a conductive film that can be patterned and transferred arbitrarily. Moreover, on the basis of ensuring the properties of the film, the manufacturing process we hope to achieve must be simple, low-cost, and environmentally friendly at the same time. production and sustainability requirements. Since the discovery of ITO material, its superior electro...

AI Technical Summary

Problems solved by technology

In the overall conductive film structure, because of the addition of an adhesion-enhancing layer, the nano-metal material on the conductive layer can be firmly fixed, which solves the problem of poor adhesion between the nano-metal material and the substrate; especially in the patterning process , to prevent the nano-metal material from falling off from the substrate, and to maintain the stability of the conductive structure when using large-scale automated production equipment for processing in the later stage; Define the conductive pattern, and then transfer the entire patterned conductive layer through the transfer layer

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