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Washing solution for surface of electroless tin plating film, replenishing solution for said washing solution, and method for forming tin plating layer

A cleaning solution and coating technology, which is applied in the reinforcement of conductive patterns, cleaning/polishing of conductive patterns, coating, etc., can solve the problems of step pollution, reduce the advantages of continuous productivity of horizontal transportation, and improve efficiency without difficulty Excellent effect of crystallization and stability

Inactive Publication Date: 2017-08-29
MEC CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the substrate is conveyed by the roller conveyance method, etc., and the plating is continuously carried out to the water washing step (horizontal conveyance method), the crystals attached to the surface of the film will transfer and adhere to the substrate conveyance path (transport rollers or the wall surface of the bath, etc.), resulting in steps. pollution and other issues
In order to prevent such problems, the plating solution in the plating tank and the water in the washing tank must be replaced frequently, which reduces the advantage of continuous productivity of horizontal conveying

Method used

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  • Washing solution for surface of electroless tin plating film, replenishing solution for said washing solution, and method for forming tin plating layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to Embodiment 19 and comparative example 1 to comparative example 7

[0074] (wash with new solution)

[0075] Electroless tin plating was performed in the same manner as in the aforementioned reference example. After immersing the copper-clad laminate taken out from the plating solution in the cleaning solution (25° C.) of the composition shown in Table 1 for 10 seconds, it was washed with water and dried in the same manner as the reference example. Also, in Comparative Example 7, an attempt was made to adjust the solution by blending tin salt (stannous sulfate) so that the tin concentration became 1% by weight, but the following evaluation was not performed because part of the tin salt was not dissolved.

[0076] (cleaning with continuous use fluid)

[0077] Add 30 parts by weight of the above-mentioned replacement tin plating solution to 100 parts by weight of the new solution shown in Table 1 (composition is equivalent to the cleaning solution after being brought into the plating solution due to continuous use; tin concentration is 0.27% by...

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Abstract

The present invention relates to: a washing solution for a tin plating film, which can be used for washing in advance of the washing with water after electroless tin plating; and a method for forming a tin plating layer, which includes a step of washing with the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution contains the chloride ion at a concentration of 2% by weight or more, and also contains tin at a concentration of 0.5% by weight or less. The washing solution according to the present invention has good washing performance against the surface of a tin plating film, can maintain the properties of the tin plating film readily, has a small influence on the surface of the plating film even when used continuously, and has excellent long-term stability.

Description

technical field [0001] The present invention relates to a cleaning solution and a replenishing solution for cleaning a tin-plated film in a state where the plating solution after electroless tin plating is adhered to the surface. Moreover, this invention relates to the formation method of the tin plating layer which has the washing|cleaning process using this washing|cleaning liquid. Background technique [0002] A general multilayer wiring board is manufactured by sandwiching an inner layer substrate having a conductive layer made of copper or copper alloy between prepregs and laminating it with other inner layer substrates or copper foil. The conductive layers are electrically connected through a through-hole, and the through-hole is a through-hole whose wall is plated with copper. In order to improve the adhesiveness between the conductive layer and resins such as prepregs and solder, it is known to use a roughening agent (micro-etching agent) to form fine unevenness on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16H05K3/24H05K3/26
CPCH05K3/24H05K3/26C23C18/1834C23C18/54H05K2203/0789C23C18/1689C23C18/31C23G1/10H05K3/181H05K3/187H05K2203/072
Inventor 柴沼祐子伍田龙矢仁顷丈二郎市桥知子上甲圭佑山田崇弘天谷刚
Owner MEC CO LTD
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