Uncooled infrared focal plane detector array thermal response time test system and method

一种焦平面探测器、非制冷红外的技术，应用在红外探测器领域，能够解决设计参数与实测参数差距较大、热响应时间精度低、工艺不稳定性等问题，达到测试结果稳定可靠、测试用时短、可行性强的效果

Active Publication Date: 2017-09-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

However, at present, the acquisition of thermal response time mainly relies on simulation or low-precision evaluation methods. Due to the lack of various material parameters and the instability of the process, there is often a large gap between the design parameters and the measured parameters, which cannot guide Process parameter adjustment

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  • Uncooled infrared focal plane detector array thermal response time test system and method
  • Uncooled infrared focal plane detector array thermal response time test system and method
  • Uncooled infrared focal plane detector array thermal response time test system and method

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Embodiment Construction

[0024] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0025] Such as figure 2 As shown, a thermal response time testing system for an uncooled infrared focal plane detector array includes a cavity black body 1, a chopper 2, a tested detector assembly 4, and a testing system 5, and the tested detector assembly includes a Measure the uncooled infrared focal plane detector array, adapter board, and optical lens 3. The optical lens is placed in front of the measured uncooled infrared focal ...

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Abstract

The invention provides an uncooled infrared focal plane detector array thermal response time test system and method. The system comprises a black body, a chopper, a detected detector assembly, and a test system. The test method includes: radiations emitted by the black body are chopped by the chopper and are irradiated to a tested uncooled infrared focal plane detector array, the tested uncooled infrared focal plane detector array generates different responses for the radiations of different frequencies, response values of the tested uncooled infrared focal plane detector array with different chopping frequencies are acquired, response amplitudes of corresponding frequency points in a frequency domain are obtained through fast Fourier transform (FFT), and the thermal response time is calculated through fitting according to a formula shown in the description. According to the method, FFT is employed, the influence of noise on the test of the thermal response time is effectively eliminated, the measuring precision is high, and test results are reliable and stable; and the test can be conducted by employing standard devices including the black body and the chopper etc., the test time is short, the feasibility is high, and the efficiency is high.

Description

technical field [0001] The invention relates to the technical field of infrared detectors, in particular to a testing system and testing method for thermal response time of an uncooled infrared focal plane detector array. Background technique [0002] Uncooled infrared focal plane array technology is the main direction of infrared technology development today. Uncooled infrared focal plane detectors have the characteristics of small size, light weight, high cost performance and low power consumption, and are widely used in various fields such as military, industry, medical and health, scientific research and environmental monitoring. Thermal response time is an important parameter to measure the performance of uncooled infrared focal plane detectors. When the incident radiation hitting the detector changes, it takes time for the output of the detector to rise or fall to a stable value corresponding to the radiation power. [0003] The shorter the thermal response time of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00
CPCG01J5/00G01J5/80G01J5/53G01J5/10G01R31/2656
Inventor 刘子骥李成世熊兴余段辉张鸿波范益红袁凯
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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