Heat dispersion resin composition for LED (Light-emitting Diode) base plate and preparation method thereof

A technology of resin composition and LED substrate, which is applied in the field of heat-dissipating resin composition, can solve the problems such as the increase of the working temperature of the LED chip, and achieve the effect of improving the service life and suppressing the increase of temperature

Active Publication Date: 2017-09-19
SHENZHEN LONGRUN LED OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to obtain high-brightness LEDs in practical applications, on the one hand, the input power of the chip can be increased, and on the other hand, the packaging density can be increased, but both methods will lead to a significant increase i...

Method used

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  • Heat dispersion resin composition for LED (Light-emitting Diode) base plate and preparation method thereof
  • Heat dispersion resin composition for LED (Light-emitting Diode) base plate and preparation method thereof
  • Heat dispersion resin composition for LED (Light-emitting Diode) base plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A preparation method for a heat-dissipating resin composition for an LED substrate, comprising:

[0045] Step 1) prepare epoxy resin A,

[0046] Step 1.1) prepare the epoxy compound B of formula (II) structure,

[0047] Dissolve 4-hydroxybiphenyl in excess epichlorohydrin, add potassium hydroxide, the molar ratio of 4-hydroxybiphenyl to potassium hydroxide is 1.2, react at 100°C for 4 hours, and distill the unreacted ring under reduced pressure Oxychloropropane, the product of vacuum distillation is washed with distilled water, and dried to obtain epoxy compound A;

[0048]

[0049] Step 1.2), mix epoxy compound B, R-N(H)-R', R and R' connected to N are C2 alkyl and C4 linear alkyl respectively, react at 110°C for 2min, add epoxy resin CYD -128, stirred and mixed evenly, reacted for 10min, cooled to room temperature, extracted with toluene and dried in vacuum to obtain epoxy resin A;

[0050] Step 2), disperse 60% by mass of epoxy resin A in water, add 30% by mass...

Embodiment 2

[0052] A preparation method for a heat-dissipating resin composition for an LED substrate, comprising:

[0053] Step 1) prepare epoxy resin A,

[0054] Step 1.1) prepare the epoxy compound B of formula (II) structure,

[0055] Dissolve 4-hydroxybiphenyl in excess epichlorohydrin, add potassium hydroxide, the molar ratio of 4-hydroxybiphenyl to potassium hydroxide is 1.2, react at 100°C for 4 hours, and distill the unreacted ring under reduced pressure Oxychloropropane, the product of vacuum distillation is washed with distilled water, and dried to obtain epoxy compound A;

[0056]

[0057] Step 1.2), mix epoxy compound B, R-N(H)-R', R and R' connected to N are C3 straight-chain alkyl and C6 straight-chain alkyl respectively, react at 110°C for 3 minutes, add epoxy Resin CYD-128, stirred and mixed evenly, reacted for 13 minutes, cooled to room temperature, extracted with toluene and dried in vacuum to obtain epoxy resin A;

[0058] Step 2), disperse 70% by mass of epoxy r...

Embodiment 3

[0060] A preparation method for a heat-dissipating resin composition for an LED substrate, comprising:

[0061] Step 1) prepare epoxy resin A,

[0062] Step 1.1) prepare the epoxy compound B of formula (II) structure,

[0063] Dissolve 4-hydroxybiphenyl in excess epichlorohydrin, add potassium hydroxide, the molar ratio of 4-hydroxybiphenyl to potassium hydroxide is 1.1, react at 100°C for 4 hours, and distill the unreacted ring under reduced pressure Oxychloropropane, the product of vacuum distillation is washed with distilled water, and dried to obtain epoxy compound A;

[0064]

[0065] Step 1.2), mix epoxy compound B, R-N(H)-R', R and R' connected to N are C4 straight-chain alkyl and C6 straight-chain alkyl respectively, react at 110°C for 3 minutes, add epoxy Resin CYD-128, stirred and mixed evenly, reacted for 15 minutes, cooled to room temperature, extracted with toluene and dried in vacuum to obtain epoxy resin A;

[0066] Step 2), disperse 60% by mass of epoxy r...

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PUM

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Abstract

The invention relates to a heat dispersion resin composition for an LED (Light-emitting Diode) base plate. The heat dispersion resin composition is prepared from epoxy resin A, a metal organic compound MOF and a curing agent. According to the heat dispersion resin composition provided by the invention, with the introduction of the MOF material, resin used in the composition is cured so as to further form an ordered higher order structure. The invention can provide the heat dispersion resin composition with a heat dispersion structure with excellent heat dispersion performance.

Description

technical field [0001] The present invention relates to a heat-dissipating resin composition, in particular to a heat-dissipating resin composition for LED substrates with excellent thermal conductivity and a preparation method thereof. Background technique [0002] Since the birth of Light Emitting Diode (LED for short), full color and high brightness have been realized, and white LEDs produced on the basis of blue / purple LEDs. LED components are used as light sources such as display lights due to their small size, long life, and excellent power saving. They have been widely used in automotive lighting, decorative lighting, mobile phone flashlights, and light source modules for large and medium-sized displays. [0003] When used for such a light source, it is often used to arrange two or more LED elements on a surface-mounted LED module, that is, a base substrate (substrate for LED mounting) made of metal such as aluminum, and place LED elements around each LED element. A ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/56C08G59/50
CPCC08G59/5033C08K5/56C08L2203/20C08L63/00
Inventor 李颂凌洪周立冬
Owner SHENZHEN LONGRUN LED OPTOELECTRONICS CO LTD
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