Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat dissipation resin composition for LED substrate and preparation method thereof

A technology of resin composition and LED substrate, applied in the field of heat-dissipating resin composition, can solve problems such as the increase of working temperature of LED chips, and achieve the effects of improving lifespan and suppressing the increase of temperature

Active Publication Date: 2018-05-04
SHENZHEN LONGRUN LED OPTOELECTRONICS CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to obtain high-brightness LEDs in practical applications, on the one hand, the input power of the chip can be increased, and on the other hand, the packaging density can be increased, but both methods will lead to a significant increase in the operating temperature of the LED chip, and the thermal management of the LED has already It has become a severe challenge to its development, and there is an urgent need for excellent heat dissipation measures to solve the heat dissipation problem of LEDs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation resin composition for LED substrate and preparation method thereof
  • Heat dissipation resin composition for LED substrate and preparation method thereof
  • Heat dissipation resin composition for LED substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A preparation method for a heat-dissipating resin composition for an LED substrate, comprising:

[0045] Step 1) prepare epoxy resin A,

[0046] Step 1.1) prepare the epoxy compound B of formula (II) structure,

[0047] Dissolve 4-hydroxybiphenyl in excess epichlorohydrin, add potassium hydroxide, the molar ratio of 4-hydroxybiphenyl to potassium hydroxide is 1.2, react at 100°C for 4 hours, and distill the unreacted ring under reduced pressure Oxychloropropane, the product of vacuum distillation is washed with distilled water, and dried to obtain epoxy compound A;

[0048]

[0049] Step 1.2), mix epoxy compound B, R-N(H)-R', R and R' connected to N are C2 alkyl and C4 linear alkyl respectively, react at 110°C for 2min, add epoxy resin CYD -128, stirred and mixed evenly, reacted for 10min, cooled to room temperature, extracted with toluene and dried in vacuum to obtain epoxy resin A;

[0050] Step 2), disperse 60% by mass of epoxy resin A in water, add 30% by mass...

Embodiment 2

[0052] A preparation method for a heat-dissipating resin composition for an LED substrate, comprising:

[0053] Step 1) prepare epoxy resin A,

[0054] Step 1.1) prepare the epoxy compound B of formula (II) structure,

[0055] Dissolve 4-hydroxybiphenyl in excess epichlorohydrin, add potassium hydroxide, the molar ratio of 4-hydroxybiphenyl to potassium hydroxide is 1.2, react at 100°C for 4 hours, and distill the unreacted ring under reduced pressure Oxychloropropane, the product of vacuum distillation is washed with distilled water, and dried to obtain epoxy compound A;

[0056]

[0057] Step 1.2), mix epoxy compound B, R-N(H)-R', R and R' connected to N are C3 straight-chain alkyl and C6 straight-chain alkyl respectively, react at 110°C for 3 minutes, add epoxy Resin CYD-128, stirred and mixed evenly, reacted for 13 minutes, cooled to room temperature, extracted with toluene and dried in vacuum to obtain epoxy resin A;

[0058] Step 2), disperse 70% by mass of epoxy r...

Embodiment 3

[0060] A preparation method for a heat-dissipating resin composition for an LED substrate, comprising:

[0061] Step 1) prepare epoxy resin A,

[0062] Step 1.1) prepare the epoxy compound B of formula (II) structure,

[0063] Dissolve 4-hydroxybiphenyl in excess epichlorohydrin, add potassium hydroxide, the molar ratio of 4-hydroxybiphenyl to potassium hydroxide is 1.1, react at 100°C for 4 hours, and distill the unreacted ring under reduced pressure Oxychloropropane, the product of vacuum distillation is washed with distilled water, and dried to obtain epoxy compound A;

[0064]

[0065] Step 1.2), mix epoxy compound B, R-N(H)-R', R and R' connected to N are C4 straight-chain alkyl and C6 straight-chain alkyl respectively, react at 110°C for 3 minutes, add epoxy Resin CYD-128, stirred and mixed evenly, reacted for 15 minutes, cooled to room temperature, extracted with toluene and dried in vacuum to obtain epoxy resin A;

[0066] Step 2), disperse 60% by mass of epoxy r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a heat dispersion resin composition for an LED (Light-emitting Diode) base plate. The heat dispersion resin composition is prepared from epoxy resin A, a metal organic compound MOF and a curing agent. According to the heat dispersion resin composition provided by the invention, with the introduction of the MOF material, resin used in the composition is cured so as to further form an ordered higher order structure. The invention can provide the heat dispersion resin composition with a heat dispersion structure with excellent heat dispersion performance.

Description

technical field [0001] The present invention relates to a heat-dissipating resin composition, in particular to a heat-dissipating resin composition for LED substrates with excellent thermal conductivity and a preparation method thereof. Background technique [0002] Since the birth of Light Emitting Diode (LED for short), full color and high brightness have been realized, and white LEDs produced on the basis of blue / purple LEDs. LED components are used as light sources such as display lights due to their small size, long life, and excellent power saving. They have been widely used in automotive lighting, decorative lighting, mobile phone flashlights, and light source modules for large and medium-sized displays. [0003] When used for such a light source, it is often used to arrange two or more LED elements on a surface-mounted LED module, that is, a base substrate (substrate for LED mounting) made of metal such as aluminum, and place LED elements around each LED element. A ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/56C08G59/50
CPCC08G59/5033C08K5/56C08L2203/20C08L63/00
Inventor 李颂凌洪周立冬
Owner SHENZHEN LONGRUN LED OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com