Laser cutting system and method for IC cards
A laser cutting and laser technology, used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of high operator requirements, high energy consumption of die punching operation, and low processing efficiency.
Active Publication Date: 2017-09-22
深圳华创兆业科技股份有限公司
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[0030] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
[0031] If there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, they are only used to explain the relative positions of the components in a certain posture (as shown in the drawings) relationship, motion, etc., if the particular pose changes, the directional indication changes accordingly.
[0032] In addition, in the present invention, the descriptions involving "first", "second" and so on are only for the purpose of description, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined as ...
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Abstract
The embodiment of the invention discloses a laser cutting system and method for IC cards. The cutting system comprises an industrial personal computer, a laser unit, a galvanometer spectroscope assembly, an OCR positioning device, an operation table, a conveying device, a transparent pressure board and a vacuum adsorption table, wherein the laser unit, the galvanometer spectroscope assembly, the OCR positioning device, the conveying device, the operation table, and the vacuum adsorption table are all connected with the industrial personal computer; the laser unit is a carbon dioxide laser; the conveying device conveys large card materials to be cut; the transparent pressure board is provided with a card angle reserved hole; the vacuum adsorption table uses air pressure to adsorb and fix the large card materials; the OCR positioning device is used for detecting the positions of the large card materials; and the industrial personal computer controls the galvanometer spectroscope assembly and then adjust laser beams for cutting according to the position information detected by the OCR positioning device. The laser rays are adopted to cut the IC card, the problems that the machining efficiency is low, the energy consumption is high, the noise is high and operation is complex are solved, and the production cost of the IC cards is reduced.
Description
technical field [0001] The invention relates to the technical field of IC card processing, in particular to a laser cutting system and method for an IC card. Background technique [0002] In the prior art, IC card punching uses male and female molds, the inner edge of the female mold is equal to the outer edge of the male mold is equal to the shape of the product, a large card material is placed between the two molds, and the two molds are "easy to follow" Products in the shape of IC cards can be obtained. [0003] However, IC cards of different sizes need to be replaced with different molds, the processing efficiency is low, and the punching operation of the mold consumes a lot of energy and noise, and requires high requirements for operators. Contents of the invention [0004] The technical problem to be solved by the embodiments of the present invention is to provide a laser cutting system and method for IC cards, so as to achieve high processing efficiency, low energy...
Claims
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Inventor 朱建平
Owner 深圳华创兆业科技股份有限公司