Micro heat pipe temperature equalization plate-based closed electronic cabinet device and assembly method thereof

Abstract

The invention relates to a micro heat pipe temperature equalization plate-based closed electronic cabinet device and an assembly method thereof. The closed electronic cabinet device comprises a cabinet, a micro heat pipe heat dissipation module, a flange plate and an axial flow fan, wherein the flange plate is fixed in a flange plate installation groove in the cabinet and is used for dividing the cabinet into a closed region at an upper part and a non-closed region at a lower part, the micro heat pipe heat dissipation module comprises a micro heat pipe temperature equalization plate, penetrates through an installation hole in the flange plate and is fixed on the flange plate, the flange plate is used for dividing the micro heat pipe heat dissipation module into an upper part and a lower part, and the axial flow fan is arranged in the non-closed region of the cabinet. A traditional heat dissipation strategy cannot conform to heat dissipation demand of an electronic cabinet to cause frequent equipment faults; and in the closed electronic cabinet device, a working region of electronic equipment is isolated as the closed region by the flange plate, heat emitted from the electronic equipment is conducted to the non-closed region by the micro heat pipe temperature equalization plate, the sealing requirement of the working region of the electronic equipment can be met, the heat in the closed region can also be effectively dissipated, and a reliable working environment is provided for the electronic equipment.

Description

technical field [0001] The invention relates to an airtight electronic cabinet device, in particular to an airtight electronic cabinet device based on a micro heat pipe equal temperature plate and an assembly method thereof. Background technique [0002] With the rapid development of microelectronics technology, the feature size of electronic devices has been continuously reduced, and the chip integration, packaging density, and operating frequency have been continuously increased, resulting in a rapid increase in chip heat flux and heat load. Studies have shown that when the operating temperature of electronic components exceeds the normal range by 10°C, the reliability of the system will drop by 50%. Once the heat in the cabinet cannot be dissipated quickly and effectively, it will cause the inside of the cabinet to overheat, which may overheat and burn the electronic equipment or precision electronic components in it, affecting normal operation. At present, the heat diss...

AI Technical Summary

Problems solved by technology

In the former case, only a part of the side wall of the housing is in contact with the heating element, and most of the side walls do not have the effect of heat dissipation, so the heat dissipation effect is relatively poor.

The latter has a strong heat dissipation capability and is easy to achieve temperature control inside the cabinet, but it is expensive, consumes a lot of energy, has a complex structure, is inconvenient to install, relatively complicated to control, and has a large maintenance workload

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