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Packaging structure of UVLED (ultraviolet light emitting diode) lamp

A packaging structure and lamp holder technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of complex process, poor anti-aging energy, etc., and achieve the effects of improving mechanical strength, low cost, and increasing optional range.

Pending Publication Date: 2017-09-26
XIAMEN UM OPTO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention aims to provide a packaging structure for UV LED lamps, starting from the improvement of the packaging structure of the lamp, thereby solving the technical problems of poor anti-aging performance and complex process of the existing packaging structure

Method used

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  • Packaging structure of UVLED (ultraviolet light emitting diode) lamp
  • Packaging structure of UVLED (ultraviolet light emitting diode) lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] see figure 1 and figure 2 , the present invention relates to a packaging structure for UV LED lamps, including a lamp holder 10, four UV chips 20 and a glass cover 30 for covering the lamp holder 10, the top surface 11 of the lamp holder 10 is concave downward There is a groove 12, and four UV chips 20 are arranged in a rectangular array on the bottom surface 121 of the groove 12, and then each UV chip 20 is encapsulated by UV LED chip fusion glass, and the UV LED chip and the lamp holder 10 are electrically connected. connect.

[0018] The glass cover plate 30 is bonded and covered on the top surface 11 of the lamp holder 10 through an adhesive layer 40. Silver powder is arranged in the adhesive layer 40. The particle size of the silver powder is 10-80 microns, and the amount of silver powder added is 30% of the adhesive layer 40, and the distribution of silver powder in the adhesive layer 40 gradually decreases from the surface of the layer to the bottom of the lay...

Embodiment 2

[0020] The structure of this embodiment is substantially the same as that of Embodiment 1, the same structure will not be described in detail, and only the differences will be described. In this embodiment, ceramic powder is arranged in the adhesive layer 40, the particle size of the ceramic powder is 20-80 microns, and the amount of ceramic powder added is 55% of the adhesive layer 40, and the ceramic powder is bonded The distribution amount in the adhesive layer 40 gradually decreases from the surface of the layer to the bottom of the layer. The steps of adding the ceramic powder into the adhesive layer 40 are consistent with that of Embodiment 1.

Embodiment 3

[0022] The structure of this embodiment is substantially the same as that of Embodiment 1, the same structure will not be described in detail, and only the differences will be described. In the present embodiment, what is arranged in the adhesive layer 40 is a mixture of ceramic powder and silver powder, the particle size of the silver powder is 10-80 microns, the particle size of the ceramic powder is 20-80 microns, the addition of the silver powder and the ceramic powder mixture The amount is 80% of the adhesive layer 40, and the distribution amount of the mixture of ceramic powder and silver powder in the adhesive layer 40 gradually decreases from the surface of the layer to the bottom of the layer. The steps of adding the mixture of ceramic powder and silver powder into the adhesive layer 40 are consistent with that of Embodiment 1.

[0023] It should be noted that the adhesive layer of the present invention may also use an inorganic adhesive layer, adding metal powder and...

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Abstract

The invention provides a packaging structure of a UVLED (ultraviolet light emitting diode) lamp. The packaging structure comprises a lamp holder, UV wafers and a glass cover plate used for covering the lamp holder, wherein a groove is formed in the top surface of the lamp holder and is downwards concaved, the UV wafers are fixed on a bottom surface of the groove, the glass cover plate is glued on the top surface of the lamp holder through an adhesive layer in a covering manner, and metal powder and / or ceramic powder are / is placed in the adhesive layer. According to the packaging structure of the UVLED lamp, the penetration strength of UV rays in the adhesive layer can be weakened by placing the metal powder and / or the ceramic powder in the adhesive layer, so that most adhesion characteristics of the adhesive layer are reserved.

Description

technical field [0001] The invention relates to the field of LED lighting equipment, in particular to a package structure of a UV LED lamp. Background technique [0002] UV LED lamp is a kind of LED lamp, which is invisible light of single wavelength, generally below 400nm. Through professional design, UV LED lamps can present different shapes and different irradiance spots to meet the production needs of edge banding, printing and other fields. It has super long life, cold light source, no heat radiation, stable performance, less replacement times and has bactericidal effect, which is safer and more environmentally friendly than traditional light sources. Various fields have a wide range of applications. [0003] At present, when UV LED lamps are packaged, the glass cover is usually directly welded and fixed on the lamp holder, or the glass cover is bonded and fixed on the lamp holder by using organic materials such as benzene ring and silica gel. Organic materials bonde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/56
CPCH01L25/0753H01L33/56
Inventor 李恒彦王亚山黄敏李儒维
Owner XIAMEN UM OPTO TECH