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Endoscopes and cameras

A technology of a camera device and an endoscope, applied in the field of endoscopy, can solve the problems without any disclosure or teaching.

Active Publication Date: 2019-08-16
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the above publications, there is no disclosure or teaching about the influence of moisture penetrating through the sealing resin.

Method used

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  • Endoscopes and cameras
  • Endoscopes and cameras
  • Endoscopes and cameras

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0030] Such as figure 1 As shown, the endoscope 2 of this embodiment and the processor 4 constitute an endoscope system 9. The endoscope 2 has: a front end portion 2a, which is provided with an imaging unit 3 including the imaging device 1, an elongated insertion portion 2b, which extends from the front end portion 2a, and an operation portion 2c, which is provided on the insertion portion The base end side of 2b; the universal cable 2d, which extends from the operation portion 2c; and the connector 2e, which is arranged on the base end side of the universal cable 2d.

[0031] The connector 2e is connected to the processor 4 in a detachable manner. The processor 4 performs signal processing on the imaging signal of the imaging device 1 and outputs the image signal to the monitor 4A.

[0032] Such as Figure 2 ~ Figure 4 As shown, the imaging device 1 has an imaging element 10, a glass cover 30 as a transparent member, and an adhesive layer 20 that bonds the imaging element 10 and...

no. 2 approach

[0068] Next, the endoscope 2D of the second embodiment will be described. The endoscope 2D is similar to the endoscope 2 of the first embodiment, and therefore the same components are denoted by the same reference numerals and the description is omitted.

[0069] The endoscope 2D is different from the endoscope 2 of the first embodiment in the structure of the protector 40D.

[0070] Such as Picture 11 As shown, the protective portion 40D of the imaging device 1D of the endoscope 2D includes not only the blocking particles 42 but also moisture-absorbing particles 43 having a water absorption rate higher than that of the resin 41.

[0071] The water absorption is evaluated in accordance with JIS 7209. For example, when an epoxy resin or a silicone resin is used as the resin 41, moisture-absorbing particles 43 made of carbon black, carbon nanotubes, bentonite, or zeolite are used.

[0072] The moisture absorbing particles 43 trap the moisture immersed in the resin 41. Therefore, the ...

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PUM

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Abstract

An endoscope (2) is equipped with an imaging device (1) at the front end (2a) of the insertion part, and the imaging device (1) has: an imaging element (10) having a semiconductor substrate (11) and a wiring layer (12 ), the semiconductor substrate (11) is formed with an imaging unit (13) on the first main surface (10SA), has a bonding terminal (18) on the second main surface (10SB), and the wiring layer (12) is arranged on On the first main surface (10SA) of the semiconductor substrate (11), a conductive layer (12A) is laminated through an insulating layer (12B, 12C); and a glass cover (30), which covers The whole of the first main surface side of the imaging element (10) is bonded, wherein the endoscope (2) has a protection part (40), and the protection part (40) at least covers the imaging element (10) On the side surface of the wiring layer (12), the protective portion (40) is obtained by dispersing blocking particles (42) having moisture permeability lower than that of the resin (41) in the resin (41). of.

Description

Technical field [0001] The present invention relates to an endoscope provided with an imaging device having a low dielectric constant material in a wiring layer, and the imaging device. Background technique [0002] A chip-scale packaged imaging device including an imaging element with a light-receiving portion formed on a main surface (light-receiving surface) is used in an endoscope because of its small diameter. The light-receiving portion is composed of a CMOS light-receiving element or the like. In order to achieve the compatibility between the light-receiving portion composed of a fine pattern produced using semiconductor technology and the large bonding electrode connected to a wiring board or the like, a wiring layer composed of a conductor layer and an insulating layer is indispensable in an imaging element. In recent years, in order to improve the performance of imaging devices, a method of using a material with a low dielectric constant lower than that of silicon oxide...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B1/04
CPCA61B1/04A61B1/05G02B23/243
Inventor 藤森纪幸
Owner OLYMPUS CORP