Novel bandwidth solid state power amplifier having interpenetrating type design

Abstract

The invention provides a novel bandwidth solid state power amplifier having an interpenetrating type design. A structural design that power synthesizers and radiators are interpenetrated is adopted, so a space resource is fully utilized. As a heat pipe three-dimensional cross embedded distribution is adopted by the radiators, the heat dissipation efficiency is effectively improved; branches of the power amplifier are respectively provided with an amplitude-phase adjuster, so the consistency between an amplitude and a phase of each branch can be adjusted, thereby improving the synthetic efficiency. By adopting the above scheme, an applicable frequency range of the bandwidth solid state power amplifier complete machine can cover a plurality of frequency bands of microwave and millimeter waves, and an output power can be flexibly adjusted according to bandwidth requirements of different frequency bands and a specific power device.

Description

Technical field [0001] The invention relates to the technical field of power amplifiers, in particular to a new type of broadband solid-state power amplifier with a plug-in design. Background technique [0002] With the wide application of microwave and millimeter wave technology in the fields of radar, guidance, and communications, higher and higher requirements are put forward for the bandwidth, gain, and output power of microwave and millimeter wave solid-state power amplifiers. In the lower frequency band, due to the large physical size of the power combiner, it is difficult to make the whole machine smaller; and with the increase of power, the heat dissipation problem becomes more prominent; in the case of multi-channel power combining, the amplitude is the same The performance is difficult to guarantee, which will affect the synthesis efficiency to a certain extent. [0003] Traditional solid-state power amplifiers mostly adopt the integrated design of passive power division...

AI Technical Summary

Problems solved by technology

In the lower frequency band, due to the limitation of the physical size of the power combiner, it is difficult to make the whole machine smaller; and as the power increases, the problem of heat dissipation becomes more prominent; in the case of multi-channel power combination, the amplitude and phase are consistent It is difficult to guarantee the stability, which will have a certain impact on the synthesis efficiency

[0003] Traditional solid-state power amplifiers mostly adopt the idea of ​​integrated design of passive power divider combiner and active power amplifier. The heat dissipation capacity is restricted by the combiner, making it difficult to make full use of space resources, and the heat dissipation efficiency is low.

Traditional power amplifiers use a relatively single heat sink, using general aluminum heat dissipation fins, and the heat dissipation efficiency is greatly limited by the material

like figure 1 As shown, the amplitude and phase consistency of electromagnetic signals in different branches of traditional power combiners are greatly affected by devices, processing and assembly, and cannot be adjusted independently

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