Semiconductor packaging method capable of improving precision of upper cover plate

Abstract

The invention discloses a semiconductor packaging method capable of improving the precision of an upper cover plate. A plurality of chips are arranged on a substrate, the active sides of the chips are arranged far from the substrate and electrically connected to the substrate. Before transparent cover plates are assembled to the active sides of the chips, an identification characteristic point layer is added to the external surface of each cover plate to facilitate identification and position calibration by an assembly machine to held the assembly machine to calibrate position. The cover plates are assembled afterwards. The assembly qualified rate is greatly improved. After the upper covers are assembled, the characteristic points on the surfaces of the cover plates are removed. Die sealing and single-body cutting and subsequent packaging processes are than conducted. The position error of assembled cover plates after assembly can be reduced, and the surfaces of the cover plates are smooth, clean and free of stain and marks.

Description

technical field [0001] The invention relates to the field of induction chip packaging, in particular to a semiconductor packaging method for improving the precision of an upper cover plate. Background technique [0002] In general, chip packaging products mainly use epoxy resin to mold and coat the chip on a substrate, and then perform singulation to complete the package. One of the chip packaging products is required to be equipped with a cover on the exterior surface. For example, a fingerprint sensor chip should be equipped with a transparent material cover on the package surface, and a high-heat chip should be equipped with a high thermal conductivity metal cover on the package surface. A packaging method for the top cover directly uses a large-area cover mother chip when molding, and cuts the cover master chip in addition to the encapsulant and the substrate when cutting the order. The cutting stress will remain between the cover plate and the chip, or cause cracks bet...

AI Technical Summary

Problems solved by technology

Since the final packaging product requires the outer surface of the transparent material cover to be clean and flawless without leaving any imprints or marks, there is no way to correctly identify where the transparent material cover is installed when using an automatic machine to assemble the transparent cover. The position on the chip, after the assembly is completed, the position error of the transparent material cover will be greater than + / -50 microns (µm)

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