Dummy board of circuit board VCP
A technology for accompanying plating boards and circuit boards, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of increasing scrap costs, increasing rework costs, and thin tin plating thickness of production boards, reducing processing time and improving The effect of working efficiency and reducing scrap cost
Active Publication Date: 2017-10-20
DALIAN CHONGDA CIRCUIT
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Problems solved by technology
[0004] The copper plating thickness of the first and last production boards is thin, which needs to be reworked, which increases the cost of rework and prolongs the processing time of the production boards in this process.
[0005] The thickness of the tin plating on the first and last production boards is thin. During the etching process, tin does not resist corrosion, resulting in thin etching lines and scrapping, which increases scrapping costs.
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[0016] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0017] figure 1 It is a schematic diagram of the accompanying plating plate structure of a circuit board VCP of the present invention, as figure 1 As shown, the accompanying plate of the present embodiment can include:
[0018] The copper foil 101 arranged around the accompanying plate, the copper skin 102 arranged on the front side of the accom...
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The invention provides a dummy board of circuit board VCP. The dummy board comprises a copper foil which is arranged at the periphery of the dummy board, a copper sheath which is arranged on the front surface of the dummy board and a copper sheath which is arranged on the reverse surface of the dummy board. The problems in the prior art that current is not displayed when the dummy board enters a copper cylinder and a tin cylinder because of the fact that an electronic inductor cannot recognize the board in entering of the board due to the fact that the copper is only laid on the process side of the dummy board can be solved. The processing time can be reduced, the scrap cost can be reduced and the work efficiency can be enhanced.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a VCP accompanying plate of a circuit board. Background technique [0002] In order to ensure that during the VCP processing process of the normal production board, the edge of the first board and the last board will not cause burning problems due to excessive current, add a plating board before and after the production board. [0003] At present, there are the following problems in the circuit board using the plated board: [0004] The copper plating thickness of the first and last production boards is thin, which needs to be reworked, which increases the cost of rework and prolongs the processing time of the production boards in this process. [0005] The first and last production boards are thinly plated with tin, and during etching, some tin does not resist corrosion, resulting in thin etching lines and scrapping, which increases scrapping costs. Contents of the inv...
Claims
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IPC IPC(8): H05K3/18
CPCH05K3/18H05K2203/0723
Inventor 赵金亮
Owner DALIAN CHONGDA CIRCUIT