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Micro-channel heat dissipation chip and preparation method thereof

A technology of micro-fluid channel and micro-fluid channel, which is applied in the field of micro-channel heat dissipation chip and its preparation, can solve the problems of uncontrollable liquid flow rate and structural limitation, and achieve the effect of precise control of heat dissipation effect and low cost

Active Publication Date: 2017-10-24
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the continuous advancement of micro-nano processing technology, the miniaturization of most devices has gradually begun to be put on the agenda. At present, micro-channel heat dissipation chips have appeared, but due to structural limitations, the existing micro-channel chips have Part of the area is smaller than the area of ​​the liquid inlet and outlet, so that the etching depth of the flow channel in the microchannel cooling chip with this structure is smaller than the etching depth of the liquid inlet and outlet, and the flow rate of the liquid in the flow channel cannot be controlled.

Method used

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  • Micro-channel heat dissipation chip and preparation method thereof
  • Micro-channel heat dissipation chip and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] refer to figure 1 The micro-channel heat dissipation chip provided in this embodiment includes a silicon base body 1 and an isolation layer 2 disposed on the silicon base body 1 . The isolation layer 2 is used to isolate the silicon base body 1 from the liquid flowing through the silicon base body 1 , preferably, the isolation layer 2 is pyrex7740 glass. Wherein, the thickness of the silicon base body 1 is not greater than 1.5 mm, preferably, the thickness of the silicon base body 1 is 500 microns to 1500 microns.

[0032] The top of the silicon basic body 1 is provided with an isolation groove 11, and the isolation groove 11 extends downwards from the first microfluidic channel 12, the second microfluidic channel 13 and the third microfluidic channel 14, which can be arranged according to the actual heat dissipation requirements. The number of the second microfluidic channels 13 is set. The depth of the second microfluidic channel 13 is less than the thickness of the...

Embodiment 2

[0048] This embodiment provides another preparation method for the above-mentioned microfluidic heat dissipation chip. The difference between this preparation method and the preparation method in Example 1 is that the formation sequence of the isolation groove 11 and the second microfluidic channel 13 is different. .

[0049] refer to image 3 (S1-S6), the preparation method of the microfluidic cooling chip provided in this embodiment comprises the following steps:

[0050] Step S1, coating photoresist 40 on the top of the silicon basic body 1 (refer to image 3 (S1a) shown), using the photoresist 40 as a mask, etching the top of the silicon base body 1 to form an isolation groove 11 (refer to image 3 (S1b)).

[0051] Step S2, remove the photoresist 40 on the top of the silicon base body 1 in step S1, and recoat the photoresist 50 on the top of the silicon base body 1 formed with the isolation groove 11 (refer to image 3 (shown in S2a), using the photoresist 50 as a mask...

Embodiment 3

[0059] This embodiment provides yet another preparation method for the above-mentioned microfluidic heat dissipation chip, the difference between this preparation method and the preparation method in Example 2 is that the first microfluidic channel 12 and the third microfluidic channel 14 The formation order of the second microfluidic channel 13 is different.

[0060] refer to Figure 4 (S1-S6), the preparation method of the microfluidic cooling chip provided in this embodiment comprises the following steps:

[0061] Step S1, coating photoresist 70 on the top of the silicon base body 1 (refer to Figure 4 (S1a) shown), using the photoresist 70 as a mask, etching the top of the silicon base body 1 to form an isolation groove 11 (refer to Figure 4 (S1b)).

[0062] Step S2, remove the photoresist 70 on the top of the silicon base body 1 in step S1, and recoat the photoresist 80 on the top of the silicon base body 1 formed with the isolation groove 11 (refer to Figure 4 (sho...

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Abstract

The invention provides a micro-channel heat dissipation chip and a preparation method thereof. The micro-channel heat dissipation chip comprises a silicon-based body and an isolation layer arranged on the silicon-based body. An isolation groove is formed in the top of the silicon-based body, the isolation groove stretches downwards to form a first micro-channel, a second micro-channel and a third micro-channel, and the first micro-channel and the third micro-channel are located in the two sides of the second micro-channel respectively. A first through hole corresponding to the first micro-channel and a second through hole corresponding to the third micro-channel are formed in the isolation layer. According to the micro-channel heat dissipation chip and a preparation method thereof, according to the micro-channel heat dissipation chip, the first micro-channel, the third micro-channel and the second micro-channel are set to be at different depths, so that the flow rate of liquid flowing through the micro-channel heat dissipation chip is controlled, and therefore the heat dissipation effect can be precisely controlled. The micro-channel heat dissipation chip prepared through the preparation method is low in cost and suitable for volume production.

Description

technical field [0001] The invention relates to the technical field of semiconductor and micro-nano device processing, in particular to a micro-channel cooling chip and a preparation method thereof. Background technique [0002] With the continuous advancement of micro-nano processing technology, the miniaturization of most devices has gradually begun to be put on the agenda. At present, micro-channel cooling chips have appeared, but due to structural limitations, the existing micro-channel chips have Part of the area is smaller than the area of ​​the liquid inlet and outlet, so that the etching depth of the flow channel in the microchannel cooling chip with this structure is smaller than the etching depth of the liquid inlet and outlet, and the flow rate of the liquid in the flow channel cannot be controlled. Contents of the invention [0003] In order to solve the above problems, the present invention proposes a micro-channel cooling chip and a preparation method thereof...

Claims

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Application Information

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IPC IPC(8): B81B1/00B81C1/00
CPCB81B1/00B81C1/00119
Inventor 付思齐时文华李翔刘彬缪小虎张宝顺
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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