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Micro-channel cooling chip and preparation method thereof

A microfluidic channel and microfluidic channel technology are applied in the field of microfluidic heat dissipation chips and their preparation, which can solve the problems of structural limitation and inability to control the liquid flow rate, and achieve the effect of low cost and precise control of heat dissipation effect.

Active Publication Date: 2019-08-02
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the continuous advancement of micro-nano processing technology, the miniaturization of most devices has gradually begun to be put on the agenda. At present, micro-channel heat dissipation chips have appeared, but due to structural limitations, the existing micro-channel chips have Part of the area is smaller than the area of ​​the liquid inlet and outlet, so that the etching depth of the flow channel in the microchannel cooling chip with this structure is smaller than the etching depth of the liquid inlet and outlet, and the flow rate of the liquid in the flow channel cannot be controlled.

Method used

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  • Micro-channel cooling chip and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] refer to figure 1 The micro-channel heat dissipation chip provided in this embodiment includes a silicon base body 1 and an isolation layer 2 disposed on the silicon base body 1 . The isolation layer 2 is used to isolate the silicon base body 1 from the liquid flowing through the silicon base body 1 , preferably, the isolation layer 2 is pyrex7740 glass. Wherein, the thickness of the silicon base body 1 is not greater than 1.5 mm, preferably, the thickness of the silicon base body 1 is 500 microns to 1500 microns.

[0032] The top of the silicon basic body 1 is provided with an isolation groove 11, and the isolation groove 11 extends downwards from the first microfluidic channel 12, the second microfluidic channel 13 and the third microfluidic channel 14, which can be arranged according to the actual heat dissipation requirements. The number of the second microfluidic channels 13 is set. The depth of the second microfluidic channel 13 is less than the thickness of the...

Embodiment 2

[0048] This embodiment provides another preparation method for the above-mentioned microfluidic heat dissipation chip. The difference between this preparation method and the preparation method in Example 1 is that the formation sequence of the isolation groove 11 and the second microfluidic channel 13 is different. .

[0049] refer to image 3 (S1-S6), the preparation method of the microfluidic cooling chip provided in this embodiment comprises the following steps:

[0050] Step S1, coating photoresist 40 on the top of the silicon basic body 1 (refer to image 3 (S1a) shown), using the photoresist 40 as a mask, etching the top of the silicon base body 1 to form an isolation groove 11 (refer to image 3 (S1b)).

[0051] Step S2, remove the photoresist 40 on the top of the silicon base body 1 in step S1, and recoat the photoresist 50 on the top of the silicon base body 1 formed with the isolation groove 11 (refer to image 3 (shown in S2a), using the photoresist 50 as a mask...

Embodiment 3

[0059] This embodiment provides yet another preparation method for the above-mentioned microfluidic heat dissipation chip, the difference between this preparation method and the preparation method in Example 2 is that the first microfluidic channel 12 and the third microfluidic channel 14 The formation order of the second microfluidic channel 13 is different.

[0060] refer to Figure 4 (S1-S6), the preparation method of the microfluidic cooling chip provided in this embodiment comprises the following steps:

[0061] Step S1, coating photoresist 70 on the top of the silicon base body 1 (refer to Figure 4 (S1a) shown), using the photoresist 70 as a mask, etching the top of the silicon base body 1 to form an isolation groove 11 (refer to Figure 4 (S1b)).

[0062] Step S2, remove the photoresist 70 on the top of the silicon base body 1 in step S1, and recoat the photoresist 80 on the top of the silicon base body 1 formed with the isolation groove 11 (refer to Figure 4 (sho...

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Abstract

The invention provides a micro-channel heat dissipation chip and a preparation method thereof. The micro-channel heat dissipation chip includes a silicon base body and an isolation layer arranged on the silicon base body. An isolation groove is opened on the top of the silicon base body. A first microfluidic channel, a second microfluidic channel, and a third microfluidic channel extend downward from the isolation groove, and the first microfluidic channel and the third microfluidic channel are respectively located on both sides of the second microfluidic channel ; A first through hole corresponding to the first microfluidic channel and a second through hole corresponding to the third microfluidic channel are opened on the isolation layer. The micro-channel heat dissipation chip and the preparation method thereof provided by the present invention, the micro-channel heat dissipation chip realizes the cooling of the liquid flowing through it by setting the first and third micro-fluid channels and the second micro-fluid channel to different depths The flow rate is controlled, so that the heat dissipation effect can be precisely controlled; and the cost of the micro-channel heat dissipation chip prepared by the preparation method is relatively low, and is suitable for mass production.

Description

technical field [0001] The invention relates to the technical field of semiconductor and micro-nano device processing, in particular to a micro-channel cooling chip and a preparation method thereof. Background technique [0002] With the continuous advancement of micro-nano processing technology, the miniaturization of most devices has gradually begun to be put on the agenda. At present, micro-channel cooling chips have appeared, but due to structural limitations, the existing micro-channel chips have Part of the area is smaller than the area of ​​the liquid inlet and outlet, so that the etching depth of the flow channel in the microchannel cooling chip with this structure is smaller than the etching depth of the liquid inlet and outlet, and the flow rate of the liquid in the flow channel cannot be controlled. Contents of the invention [0003] In order to solve the above problems, the present invention proposes a micro-channel cooling chip and a preparation method thereof...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B1/00B81C1/00
CPCB81B1/00B81C1/00119
Inventor 付思齐时文华李翔刘彬缪小虎张宝顺
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI