Vacuum-coating doping target material, production method thereof and vacuum coating method

Abstract

The invention discloses a vacuum-coating doping target material, a production method thereof and a vacuum coating method. The production method comprises the following steps: according to the preset size of the target material, the preset types of doping elements and the preset doping contents of the doping elements, designing the shape of a node; selecting plate materials of the needed doping elements, and according to the size of the shape, cutting and polishing the plate materials to form nodes of the needed doping elements; according to the principle of uniform distribution, arranging nodes corresponding to different doping elements according to a preset distribution mode on a target material binding substrate; binding the nodes to the target material binding substrate to form the vacuum-coating doping target material, wherein a plurality of the nodes are bound to the target material binding substrate, the nodes are sequentially piled in the first direction, and the first direction is parallel to the binding substrate; performing quality detection on the vacuum-coating doping target material. According to the technical scheme adopted by the invention, the doping target material can be conveniently and quickly produced according to the types and different contents of the doping elements.

Description

technical field [0001] The invention relates to the technical field of vacuum coating, and more specifically, to a vacuum coating doped target material, a manufacturing method thereof, and a vacuum coating method. Background technique [0002] At present, vacuum coating equipment uses pure metal or non-metal targets with a single doping element, and each target works independently, which cannot achieve sputtering co-deposition of different element materials. Generally, coating equipment adopts single target or twin target design. Single target design, that is, one power supply controls one target, and only one material can be sputtered. Twin target design, one power supply controls two targets and works alternately, even if two targets of different materials are installed, co-deposition cannot be achieved. [0003] To make a mixed target, the materials that need to be co-deposited are mixed in a certain proportion, melted, sintered, and then bound. Although this method ca...

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Problems solved by technology

Although this method can achieve co-deposition of different doping elements, for a series of targets with different doping element combinations and ratio requirements, a large number of processes such as batching, melting, sintering, and binding are required, and the production process is cumbersome and time-consuming.

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