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A preparation method of a 360-degree three-dimensional luminous light source integrated with a power supply

A technology of luminous light source and power supply, which is applied in the direction of electric light source, with built-in power supply, circuit, etc. It can solve the problems of increasing the volume of LED lamps, large volume, and rising material costs, and achieves expanded application range, firm connection, and reduced volume. Effect

Active Publication Date: 2019-12-13
ZHEJIANG EMITTING OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the structure of conventional LED lamps is usually large in size. The reason is that conventional LED lamps are mainly composed of light source, power supply and lamp housing. Independent structure, so the volume of the LED lamp is increased. As the volume increases, it has the following disadvantages. One is that the cost of materials increases greatly with the increase of materials; the other is that it is not easy to make a smaller volume LED lamps; limit the application occasions of LED lamps; third, the structure is prone to failure during transportation and use, thus increasing the maintenance cost of lamps
[0003] LED companies at home and abroad have also considered how to reduce the overall size of the LED light source, but a series of problems will follow after the reduction. One is the LED chip and many power supply materials such as rectifier tubes, voltage control tubes, control How to effectively and fixedly connect the flow tubes together electrically; the second is the heat dissipation problem after being connected together; the above two problems are also the obstacles that prevent the size of the LED light source from being greatly reduced

Method used

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  • A preparation method of a 360-degree three-dimensional luminous light source integrated with a power supply
  • A preparation method of a 360-degree three-dimensional luminous light source integrated with a power supply
  • A preparation method of a 360-degree three-dimensional luminous light source integrated with a power supply

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Embodiment Construction

[0039] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0040] A method for preparing a 360-degree three-dimensional luminous light source integrated with a power supply, mainly consisting of the following steps:

[0041] (1) First, substrate 1 needs to be prepared (see figure 1 ), the substrate 1 can be a transparent substrate, and the material of the transparent substrate can be glass, ceramics or sapphire; or a non-transparent metal substrate, and the material of the non-transparent metal substrate can be an aluminum substrate, a copper substrate or a high thermal conductivity Synthetic plastic substrate, the shape of the substrate 1 is any one of rectangle, circle, triangle, trapezoid, regular or irregular curved shape, and the thickness of the substrate 1 is within 4mm.

[0042](2) Print silver paste on one side or both sides of the light-transmitting substrate as a conductive circui...

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Abstract

The invention discloses a fabrication method of an integrated 360-degree three-dimensional luminous light source with a power supply and proposes an integrated 360-degree three-dimensional luminous lamp with a power supply on the basis of the process. The integrated 360-degree three-dimensional luminous lamp comprises a substrate with a conductive circuit, a capacitor, a power tube, a bridge stack, an IC intelligent chip and an LED chip, wherein the mentioned devices are covered by employing resin hybrid fluorescent powder on a front surface and a back surface of the substrate, heat-dissipation protection glue is wrapped, an LED three-dimensional light source for G9 can be fabricated, and meanwhile, and an ED bulb lamp, an LED crystal lamp or an LED Christmas lamp also can be fabricated. Gold deposition or silver plating is performed on a surface of an exposed chip bonding pad, an LED inverted chip employs a eutectic soldering mode, a mode of integral wrapping by the resin hybrid fluorescent powder is employed, so that the substrate, the LED chip and a plurality of power supply modules are effectively connected to form a whole, the volume of the LED light source is reduced, meanwhile, the light source is good in heat dissipation and firm in connection, and the application range is further expanded.

Description

technical field [0001] The invention relates to the field of lighting fixtures, in particular to a method for preparing a 360-degree three-dimensional luminous light source integrated with a power supply. Background technique [0002] Due to the characteristics of energy saving and high luminous efficiency, LED lamps are becoming more and more popular in the field of indoor and outdoor lighting, and gradually replace conventional tungsten and halogen lamps. At present, the structure of conventional LED lamps is usually large in size. The reason is that conventional LED lamps are mainly composed of light source, power supply and lamp housing. Independent structure, so the volume of the LED lamp is increased. With the increase of the volume, it has the following disadvantages. One is that the cost of the material increases greatly with the increase of the material; the other is that it is not easy to make it smaller LED lamps; limit the application occasions of LED lamps; thi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52F21S2/00F21S9/00
CPCF21S2/00F21S2/005F21S9/02H01L33/52
Inventor 邹军朱伟庄允益张思源
Owner ZHEJIANG EMITTING OPTOELECTRONICS TECH