Method for non-metal substrate electroless plating without palladium activation and electroless plating of low-activity metals

Abstract

The invention relates to a nonmetal matrix chemical plating non-palladium activating method and low-activity metal chemical plating method. The nonmetal matrix chemical plating non-palladium activating method includes the steps that a roughened surface of a non-metal matrix is coated with activating liquid for pre-activating; and then laser scanning is adopted for activating, and the activated nonmetal matrix is obtained. The low-activity metal chemical plating method includes the steps that low-activity metal chemical plating treatment is conducted on the non-metal matrix obtained through laser scanning activating; and a low-activity metal layer is formed on the surface of the nonmetal matrix. Due to control over the laser movement, the activating quality can be ensured, and area selecting activating can be achieved; the technology is simple, chemical plating activating treatment can be achieved on the non-metal matrix simply through simple pre-activating and laser activating after surface pretreatment, and the activating effect is good. The technology can be used for nickel plating and can also be suitable for low-activity metal chemical plating.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of electroless nickel plating, and in particular relates to a method for palladium-free activation on the surface of a non-metal material substrate for electroless plating and an electroless plating method for low-activity metals. Background technique [0002] Electroless plating is one of the most commonly used methods for metallizing non-metal surfaces, which can effectively improve the performance of non-metal surfaces and prolong the service life of non-metals. Electroless plating is to use a reducing agent to reduce and deposit metal ions in the solution on the surface with catalytic activity to form a catalytic core with self-catalytic ability, so as to continuously react to form a certain thickness of the coating. Since the non-metal itself has no catalytic activity, the non-metal surface must be activated to ensure smooth plating. [0003] The traditional palladium activation pr...

AI Technical Summary

Problems solved by technology

For example, one of the purposes of the present invention is to solve technical problems such as high cost, complicated process, heavy pollution, and poor activation effect existing in the existing palladium-free activation process.

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