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A semiconductor device packaging structure and electronic device

A packaging structure and device packaging technology, which is applied to semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as limiting circuit clock frequency

Active Publication Date: 2019-12-24
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The use of through-silicon vias in the current process is limited. The reason is that due to the continuous increase in packaging density, a large amount of heat is generated in the packaging structure and the heat is more concentrated, so that the through-silicon via packaging limits the clock speed of the circuit.

Method used

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  • A semiconductor device packaging structure and electronic device
  • A semiconductor device packaging structure and electronic device

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Embodiment 1

[0043] In order to solve this problem, the present invention provides a semiconductor device packaging structure, the following in conjunction with the attached figure 1 The packaging structure of the semiconductor device will be further explained.

[0044] Wherein, the semiconductor device packaging structure includes:

[0045] support carrier 101;

[0046] The first chip 102 is located on the support carrier;

[0047] The second chip 103 is located above the first chip and is electrically connected to the first chip;

[0048] The heat dissipation unit includes a metal layer 104 located on the upper surface side of the first chip, and a metal frame 106 connected to the metal layer, and the inner peripheral ends of the metal frame are arranged on the first chip and the second chip between.

[0049] Wherein, the support carrier 101 includes a printed circuit board (Printed Circuit Board, PCB), a heat sink or a package shell.

[0050] The printed circuit board is an importa...

Embodiment 2

[0093] An embodiment of the present invention provides an electronic device, which includes an electronic component and a semiconductor device package structure electrically connected to the electronic component.

[0094] Wherein, the semiconductor device packaging structure includes the semiconductor device packaging structure according to the first embodiment.

[0095] The electronic device can be any electronic product or equipment such as mobile phone, tablet computer, notebook computer, netbook, game console, TV, VCD, DVD, navigator, camera, video camera, recording pen, MP3, MP4, PSP, etc. It is an intermediate product with the packaging structure of the above-mentioned semiconductor device, such as a mobile phone motherboard with the integrated circuit, etc.

[0096] in, figure 2 An example of a mobile phone handset is shown. The mobile phone handset 200 is provided with a display portion 202 included in a casing 201, operation buttons 203, an external connection port...

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Abstract

The invention relates to a semiconductor device package structure and an electronic device. The package structure comprises a support carrier, a first chip, a second chip and a heat dissipation unit, wherein the chip is arranged on the support carrier, the second chip is arranged above the first chip and is electrically connected with the first chip, the heat dissipation unit comprises a metal layer and a metal frame, the metal layer is arranged at an upper surface side of the first chip, the metal frame is connected with the metal layer, and an inner peripheral end of the metal frame is arranged between the first chip and the second chip. In the package structure, heat generated by the chips is transmitted out of the support carrier by the heat dissipation unit, and the reliability and the performance of through silicon via package can be further improved; and moreover, a formation process of the heat dissipation unit can be compatible with a fabrication and package process of the semiconductor device package structure very well, so that the process cost is further reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a packaging structure of a semiconductor device and an electronic device. Background technique [0002] In the field of electronic consumption, multi-function devices are more and more popular among consumers. Compared with devices with simple functions, the production process of multi-function devices will be more complicated, such as the need to integrate multiple chips with different functions on the circuit board, so 3D integrated circuit (integrated circuit, IC) technology, 3D integrated circuit (integrated circuit, IC) is defined as a system-level integration structure, stacking multiple chips in the vertical plane direction, thereby saving space, the edge part of each chip Multiple pins can be drawn out as needed, and these pins can be used to interconnect the chips that need to be connected with each other through metal wires, but the above method still has many sh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/538
CPCH01L23/3672H01L23/5384
Inventor 徐金岭孙艳辉张冠
Owner SEMICON MFG INT (SHANGHAI) CORP