Lead frame of IPM module

Abstract

The invention discloses a lead frame of an IPM module. The lead frame comprises a lead frame panel and a feeding channel arranged on the lead frame panel, wherein at least one through hole is formed in the feeding channel; and the through hole in the feeding channel can effectively reduce the contact area between a molding compound and the lead frame and reduce an adhesive force between the molding compound and the lead frame at the position of the through hole. The lead frame does not require modification of the process of the existing equipment, thereby saving the production cost; the lead frame does not need to replace the molding compound, thereby avoiding the influence caused by replacing the molding compound on the product quality; and the problem of molding compound residue can fundamentally solved in a short time.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, and more specifically relates to a lead frame of an IPM module. Background technique [0002] In the process of removing the molding compound after molding the lead frame of the existing IPM module, it is found that there is a residue of the molding compound on the feed path of the lead frame. For the problem of mold compound residue on the lead frame: if other mold compound is used instead of the current one, due to the particularity of the product’s requirements for the mold compound (requiring high thermal conductivity, high fluidity, high insulation, etc.) and the product The reliability requirements are high, and the existing plastic packaging materials cannot meet its requirements; if the parameters of the existing process equipment are modified, it is found that this problem cannot be completely overcome. At present, the method to solve this problem is to use tools to manually remov...

AI Technical Summary

Problems solved by technology

For the problem of mold compound residue on the lead frame: if other mold compound is used instead of the current one, due to the particularity of the product’s requirements for the mold compound (requiring high thermal conductivity, high fluidity, high insulation, etc.) and the product The reliability requirements are high, and the existing plastic packaging materials cannot meet its requirements; if the parameters of the existing process equipment are modified, it is found that this problem cannot be completely overcome

[0003] However, manual removal of residual plastic compound requires full-time personnel to operate, which not only increases labor costs, but also affects product circulation, making it impossible to achieve mass production; on the other hand, due to manual operation, it is inevitable that there will be unclean removal The phenomenon of missing or missing removal will leave hidden dangers for electroplating; and the deformation of the lead frame caused by human factors will also have a certain impact on the subsequent cutting and bending

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