Electroless gold plating bath

An electroless gold plating and chemical technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve problems such as large adverse environmental impact, and achieve the effect of improving plating stability

Pending Publication Date: 2017-11-21
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to its strong toxicity, it has a large adverse impact on the environment in terms of storage and disposal, and it is desired to provide a stabilizer that replaces KCN in cyanide plating baths

Method used

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  • Electroless gold plating bath
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  • Electroless gold plating bath

Examples

Experimental program
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Effect test

Embodiment 1

[0080] In this example, in order to investigate that the cyanohydrin compound acts effectively as a stabilizer of the electroless gold plating bath, the stability, appearance, and plating film formation speed (plating speed) were investigated by the following methods.

[0081] (stability)

[0082] The gold-plating baths described in Table 1 were prepared and placed in a container, heated up to the respective temperatures described in Table 1, and then kept at the above temperatures for 24 hours. The temperature (holding temperature) in Table 1 is different because the reduction reaction temperature of Au is different due to the type of reducing agent.

[0083] While maintaining the above-mentioned temperature, the state of the plating solution was visually observed to check whether there was a sign of plating bath decomposition that gold was deposited into the container. The evaluation of no gold precipitation was 0 (good stability), and the evaluation of gold precipitation w...

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Abstract

The present invention provides a new electroless gold plating bath that can comprehensively improve the plating stability, the appearance after plating and the plating speed. The electroless gold plating bath of the present invention contains a water-soluble gold compound, a reducing agent, a complexing agent, and a stabilizer, wherein the stabilizer is a cyanohydrin compound represented by the following formula. In the formula, R1 and R2 are the same or different and represent a hydrogen atom, a silyl group, or an alkyl group or an aryl group which may be substituted with a substituent.

Description

technical field [0001] The present invention relates to electroless gold plating baths. Background technique [0002] Gold has high electrical conductivity second only to silver and copper, good physical properties such as continuity by thermocompression bonding, and good chemical properties such as oxidation resistance and chemical resistance. Therefore, gold plating using gold is widely used as a final surface treatment method for circuits of printed circuit boards, mounting parts and terminal parts of IC packages, and the like in the field of electronics industry. In recent years, along with miniaturization and high density of electronic components, it is preferable to use an electroless plating method that does not require lead wires and has good functionality. [0003] The electroless plating method typically includes the following methods depending on the plating method. [0004] (1) The electroless nickel / displacement gold plating method (Electroless Nickel Immersio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 田边克久笹村哲也西村直志染矢立志
Owner C UYEMURA & CO LTD
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