Bidirectional spiral flow channel water cooling device

Abstract

The invention relates to a large power device water cooling device and especially relates to a bidirectional spiral flow channel water cooling device. An existing water cooling device occupies a large area, a design and layout of a flow channel is unreasonable, power device layout is limited, installation and dismounting maintenance is inconvenient, a processing precision requirement is high, and a water joint and a peripheral metal support framework are intervened. By using the device of the invention, the above problems are solved. The device is characterized in that a cooling main board, a soldering plate and a cover plate are included; the cooling main board is provided with a bidirectional spiral flow channel which is in a central symmetry state, wherein a symmetric center smoothly passes through the bidirectional spiral flow channel; the cover plate is provided with two water joints which are vertical to a cover plate surface, and the water joints are connected to two ends of the flow channel; and the cover plate and a board surface of the cooling main board are provided with a plurality of installation screwed holes. The device has the following advantages that a non-uniform cooling problem is solved; the water joints can be conveniently installed, dismounted and maintained, are not intervened, and processing precision is low; a cooling liquid flows smoothly so that cooling is fast and uniform, and power device layout is simple; and there is no metal framework, an occupation area is small, and the device possesses light weight and is in a small size.

Description

technical field [0001] The invention relates to a water-cooling and heat-radiating device for high-power devices, in particular to a water-cooling and heat-radiating device with bidirectional spiral channels. Background technique [0002] Power devices such as IGBTs, power diodes, power resistors, and SiC-IGBTs are widely used in wind power, solar energy, rail transit, automobiles and other industries. Especially in the rail transit industry, due to the rapid development of high-power AC drive technology, high-power power devices are increasingly widely used, and their heat dissipation problems are becoming increasingly prominent. The water-cooled heat dissipation device can solve the heat dissipation problem of power devices with power consumption of 10kW and above, and has been widely used in the rail transit industry. The existing water-cooling and heat dissipation device is a substrate with a water flow channel inside, and water joints parallel to the surface of the sub...

AI Technical Summary

Problems solved by technology

[0005] The invention solves the problems that the existing water-cooling and heat-dissipating device occupies a large area, the flow channel design and layout are unreasonable, the installation and disassembly maintenance is inconvenient, the machining accuracy is high, and the water joint interferes with the peripheral metal support frame, and provides a two-way spiral flow channel for water cooling and heat dissipation device

The two-way spiral flow channel maximizes the use of the space on the heat sink plate surface, and there are no sharp or right angles. The flow channel is smooth. The flow rate of the coolant is from the outer ring to the inner ring, and then from the inner ring to the outer ring. The resistance encountered is uniform and does not change much. , which perfectly solves the problems of uneven overall heat dissipation of the heat sink, the surface temperature of the heat sink changes with the flow direction of the coolant, the large flow resistance is not easy to dissipate heat, and the layout of power devices is limited by the flow channel, etc.

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