Low-temperature curing type single-component epoxy adhesive

A single-component, epoxy adhesive technology, applied in the field of epoxy adhesives, can solve the problems of time-consuming and laborious ingredients on the construction site, mixing of ingredients and measuring errors, affecting bonding performance, etc., to solve softening and oxidation, reduce environmental protection pressure, pollution-free effect

Inactive Publication Date: 2017-11-28
东莞市沅邦电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The two-component epoxy adhesive has the advantages of high bonding strength, corrosion resistance, good chemical medium resistance, and small bond shrinkage. Disadvantages such as evenly affecting the bonding performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] The preparation method of described one-component epoxy glue is as follows:

[0031] Step 1, adding the modified epoxy resin into absolute ethanol, sealing and heating for 2 hours, and cooling naturally;

[0032] Step 2, add the colorant and accelerator to the reaction solution in step 1, and mechanically stir at 1000r / min until completely dissolved;

[0033] Step 3, adding the curing agent into the reaction solution, slowly adding fumed silica while stirring, and obtaining a one-component epoxy adhesive after gradient curing.

[0034] The sealed heating reaction in the step 1 is 50°C.

[0035] The stirring speed in step 3 is 2000r / min, and the gradient curing method is stirring at 80°C for 25 minutes and stirring at 120°C for 4 minutes.

Embodiment 2

[0037] A low-temperature curing type single-component epoxy adhesive, which includes 80 parts of modified epoxy resin, 20 parts of curing agent, 5 parts of accelerator, 3 parts of fumed silica and 4 parts of coloring matter in terms of mass.

[0038] The modified epoxy resin adopts silicone modified epoxy resin.

[0039] The curing agent is a mixture of vinyltriamine and m-phenylenediamine, and the ratio of vinyltriamine and m-phenylenediamine is 5:1.5.

[0040] The accelerator adopts N,N-dimethylaniline.

[0041] The solvent is ethanol aqueous solution, and the ethanol content is 30%.

[0042] The viscosity of the one-component epoxy adhesive is 15000 MPa·s.

[0043] The preparation method of described one-component epoxy glue is as follows:

[0044] Step 1, adding the modified epoxy resin into absolute ethanol, sealing and heating for 4 hours, and cooling naturally;

[0045] Step 2, add the colorant and accelerator to the reaction solution in step 1, and mechanically sti...

Embodiment 3

[0050] A low-temperature curable single-component epoxy adhesive, which includes 60 parts of modified epoxy resin, 18 parts of curing agent, 3 parts of accelerator, 2 parts of fumed silica, and 2 parts of colorant in terms of mass.

[0051] The modified epoxy resin is a phenolic modified epoxy resin.

[0052] The curing agent is a mixture of vinyltriamine and m-phenylenediamine, and the ratio of vinyltriamine and m-phenylenediamine is 5:1.

[0053] Described accelerator adopts triethanolamine.

[0054] The solvent is aqueous ethanol. The ethanol concentration of the ethanol aqueous solution was 80%.

[0055] The viscosity of the one-component epoxy glue is 14000 MPa·s.

[0056] The preparation method of described one-component epoxy glue is as follows:

[0057] Step 1, adding the modified epoxy resin into absolute ethanol, sealing and heating for 3 hours, and cooling naturally;

[0058] Step 2, add the colorant and accelerator to the reaction solution in step 1, and mecha...

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Abstract

The invention discloses a low-temperature curing type single-component epoxy adhesive. The adhesive is prepared from, by mass, 50-80 parts of modified epoxy resin, 15-20 parts of a curing agent, 2-5 parts of an accelerator, 1-3 parts of fumed silica and 1-4 parts of pigment. The single-component epoxy adhesive has the characteristic of low-temperature curing and has good elasticity.

Description

technical field [0001] The invention belongs to the technical field of epoxy glue, and in particular relates to a low-temperature curing type single-component epoxy glue. Background technique [0002] Epoxy glue has the advantages of excellent insulation, corrosion resistance, wide range of bonding objects, and high bonding strength. It is widely used in various fields of the national economy and is known as a universal glue. Most of the epoxy glues on the market are two-component epoxy glues, such as Chinese invention patents CN 102850978A and CN 102153978A. The two-component epoxy adhesive has the advantages of high bonding strength, corrosion resistance, good chemical medium resistance, and small bond shrinkage. Disadvantages such as evenly affecting the bonding performance. The one-component epoxy adhesive not only has the excellent performance of the two-component epoxy adhesive, but also makes up for the shortcomings of the two-component epoxy adhesive, but the contr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
CPCC08K3/36C09J11/04C09J163/00
Inventor 钟国沅
Owner 东莞市沅邦电子材料有限公司
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