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Laser sealed welding method for L-waveband power amplifier cavity

A power amplifier and hermetic welding technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as air oxidation, corrosion, bare chips are easily affected by the external environment, and are expensive

Inactive Publication Date: 2017-12-05
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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AI Technical Summary

Problems solved by technology

High-performance and expensive bare chips are extremely vulnerable to the external environment, such as air oxidation, corrosion, etc.

Method used

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  • Laser sealed welding method for L-waveband power amplifier cavity

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Embodiment Construction

[0016] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, not to limit the present invention.

[0017] Such as figure 1 As shown, the present invention provides a laser sealing welding method for an L-band power amplifier cavity, the laser sealing welding method for the L-band power amplifier cavity includes: Step 1, check the cavity and cover plate of the power amplifier to be welded The gap between the cavity and the cover of the power amplifier to be welded is less than 0.1mm; step 2, clean the cavity and cover of the power amplifier to be welded, and clean the power amplifier to be welded with alcohol cotton soaked in pure acetone cavity, use a vapor phase cleaning machine to clean the cover plate; step 3, put the power amplifier and the cover plate to be welded into ...

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Abstract

The invention discloses a laser sealed welding method for an L-waveband power amplifier cavity. The laser sealed welding method for the L-waveband power amplifier cavity comprises the following steps: step 1, examining matching between a cavity of a power amplifier to be welded and a cover plate; step 2, cleaning the cavity of the power amplifier to be welded and the cover plate; step 3, baking the power amplifier to be welded and the cover plate in a vacuum oven; step 4, welding the baked cover plate to the cavity of the power amplifier to be welded; and step 5, examining a welded part. By the laser sealed welding method, one-time qualified rate of laser seal welding is increased; and the laser sealed welding method plays an important role in cost saving, efficiency improving and product improving.

Description

technical field [0001] The invention relates to the field of sealing methods for power amplifier cavities, in particular to a laser sealing and welding method for L-band power amplifier cavities. Background technique [0002] With the rapid development of microelectronics technology, bare chips with small size, high integration and stable performance have been widely used in microwave circuits. For microwave circuit modules assembled by the bare chip method, hermetic packaging is a very important method link. High-performance and expensive bare chips are extremely vulnerable to the external environment, such as oxidation and corrosion by the air. Especially for naval equipment, it needs to face harsh marine environments such as high humidity, high salinity, and high corrosiveness. Hermetic packaging can well guarantee the long-term reliable and stable operation of microwave circuit modules in harsh environments. [0003] Laser sealing and welding technology has been widely...

Claims

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Application Information

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IPC IPC(8): B23K26/24B23K26/60
CPCB23K26/24B23K26/60
Inventor 徐日红费文军孟庆贤蔡庆刚汪伦源张丽
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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