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System and method of probe grinding and probe cleaning for testing probe oxidation

A technology for grinding needles, clearing needles, and testing probes, which can be applied to cleaning methods using gas flow, chemical instruments and methods, cleaning methods and utensils, etc., and can solve problems such as loss of service life of probe cards.

Active Publication Date: 2017-12-05
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 2. There is another method. In order not to affect the test efficiency, set the probe station to grind the needle regularly. Frequent grinding will reduce the service life of the probe card, especially the more expensive probe card. , the loss is quite serious
[0008] Therefore, although there are two treatment methods for the problem of probe oxidation, each has many disadvantages.

Method used

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  • System and method of probe grinding and probe cleaning for testing probe oxidation
  • System and method of probe grinding and probe cleaning for testing probe oxidation
  • System and method of probe grinding and probe cleaning for testing probe oxidation

Examples

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Embodiment 1

[0047] In order to solve the problems existing in the prior art, a needle grinding and needle cleaning system for testing the oxidation of probe card probes is provided, and the system includes:

[0048] a probe testing unit, including a probe card and protruding probes disposed in the probe card, used for wafer testing;

[0049] The imaging analysis unit includes a plurality of imaging devices arranged on the probe card substrate, the imaging devices are aligned with the needle tips of the probes, and are used to image the probes and analyze the images of the probes. Grayscale analysis;

[0050] Needle grinding and needle cleaning unit, including needle grinding equipment and / or several gas cleaning equipment, wherein the gas cleaning equipment is facing the probe, and is used for spraying gas to remove the sundries on the probe;

[0051] a control unit, which communicates with the imaging analysis unit and the needle grinding needle cleaning unit respectively, and is used t...

Embodiment 2

[0073] The present invention also provides a needle grinding and needle cleaning method for testing the oxidation of probe card probes, the method comprising:

[0074] imaging the probe to obtain an image of the probe;

[0075] Analyzing the image to obtain the grayscale of the probe;

[0076] It is judged whether the grayscale is greater than a grayscale threshold, and when the grayscale of the probe is greater than the threshold, needle grinding and / or gas needle cleaning is performed on the probe.

[0077] Specifically, as Figure 5 As shown, the steps of analyzing the image to obtain the grayscale of the probe include:

[0078] adjusting the image and calculation area of ​​the calibration probe tip;

[0079] The calculation weight of the grayscale of the probe tip is calibrated according to the current value passed by the chip pin;

[0080] Calculate the standard grayscale of the clean, unoxidized probe tip according to the weight;

[0081] Connect control COMS imagin...

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Abstract

The present invention relates to a system and method of probe grinding and probe cleaning for testing probe oxidation. The system comprises: a probe test unit comprising a probe card and a protruded probe arranged in the probe card; an imaging analysis unit comprising a plurality of imaging devices arranged on the substrate of the probe card, wherein the imaging device is aligned to the tip of the probe and is configured to perform imaging of the probe and perform analysis of the gray level of the probe; a probe grinding and probe cleaning unit comprising a probe grinding device and a plurality of gas cleaning devices, wherein the gas cleaning devices directly face the probe and are configured spray gas to remove foreign materials on the probe; and a control unit communicated with the imaging analysis unit and the probe grinding and probe cleaning unit and configured to control the imaging analysis unit to perform probe imaging and perform gray scale analysis, control the probe grinding device to perform probe grinding process and control the switching of the gas in the gas cleaning devices. The test efficiency is ensured, and the service life of the probe card is prolonged.

Description

technical field [0001] The invention relates to the field of semiconductors, and in particular, the invention relates to a needle grinding and needle cleaning system and method for testing the oxidation of probe card probes. Background technique [0002] Integrated circuit manufacturing technology is a complex process, and the technology is updated rapidly. With the continuous development of semiconductor technology, the critical dimensions of devices are getting smaller and smaller, and it is precisely because of the reduction of critical dimensions that it is possible to place millions of devices on each chip. [0003] Semiconductor devices need to be inspected during or after fabrication, such as wafer acceptance test (WAT) / wafer test (CP) and other tests. [0004] At present, in the wafer test (CP) test of the laboratory and mass-produced chips, after the probe card used is touched down for many times, the probes on the probe card will be gradually oxidized, and at the ...

Claims

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Application Information

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IPC IPC(8): G01R1/073B08B5/02
CPCB08B5/02G01R1/073
Inventor 刘琦陈致远张如山
Owner SEMICON MFG INT (SHANGHAI) CORP
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