Composite Magnetic Sealing Material

A sealing material and composite magnetic technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of mold material interface peeling, electronic components or mold material cracks, etc., and achieve the effect of small thermal expansion coefficient and warpage prevention

Active Publication Date: 2017-12-08
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] On the other hand, since the difference in physical properties between the semiconductor IC and electronic components mounted on the substrate and the mold mate

Method used

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  • Composite Magnetic Sealing Material
  • Composite Magnetic Sealing Material
  • Composite Magnetic Sealing Material

Examples

Experimental program
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Effect test

Example Embodiment

[0082] [Example]

[0083]

[0084] The resin materials were prepared by using the following formulations, namely, 830S (bisphenol A type epoxy resin) manufactured by DIC Corporation as the main agent, and 0.5 equivalent of Nippon Carbide Industries Co. as the curing agent to the main agent. DicyDD (dicyandiamide) manufactured by Inc. uses 1 wt% of C11Z-CN (Imidazole imidazole) manufactured by Shikoku Kasei Kogyo (Japan) as a curing accelerator relative to the main agent. Respectively 50% by volume, 70% by volume, or 70% by volume Figure 17 The magnetic filler of the composition shown is added to the above-mentioned resin material and thoroughly kneaded to obtain a paste. In addition, butyl carbitol acetate (butyl carbitol acetate) is added at an appropriate time when the paste cannot be made. The paste was applied to have a thickness of approximately 300 μm, and thermal curing was performed in the order of 100° C. for 1 hour, 130° C. for 1 hour, 150° C. for 1 hour, and 180° C. ...

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Abstract

Disclosed herein is a composite magnetic sealing material having a low thermal expansion coefficient. The composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby the thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/DEG C. or less.

Description

technical field [0001] The present invention relates to a composite magnetic sealing material, in particular to a composite magnetic sealing material most suitable as a molding material for electronic circuit packaging. Background technique [0002] In recent years, electronic devices such as smartphones have tended to adopt high-performance radio communication circuits and digital chips, and the operating frequency of semiconductor ICs used is also increasing. In addition, the system-in-package (SIP: system in package) with a 2.5D structure or a 3D structure that connects multiple semiconductor ICs with the shortest wiring is accelerating, and it can be predicted that the modularization of power supply system circuits will continue to increase in the future. . In addition, multiple electronic components can be predicted (passive components such as inductors, capacitors, resistors, and filters; active components such as transistors and diodes; integrated circuit components ...

Claims

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Application Information

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IPC IPC(8): H01L23/29H01L23/552
CPCH01L23/295H01L23/552
Inventor 川畑贤一
Owner TDK CORPARATION
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