Tin-printed steel net and bonding pad structure

A stencil, pad technology, applied in printed circuits, printed circuits, metallurgical bonding, etc., can solve problems such as arching, rollover, tilt, etc., to achieve reliable fixation, high SMT welding quality, and solid welding pads Effect

Pending Publication Date: 2017-12-08
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The stencil with printing holes designed in this way has a simple structure and low cost, but it is prone to the following defects: misalignment, inclination, arching and even rollover, etc., affecting product yield

Method used

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  • Tin-printed steel net and bonding pad structure
  • Tin-printed steel net and bonding pad structure
  • Tin-printed steel net and bonding pad structure

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] At present, when designing thin, bright and light LED 1 in the industry, the cooperation of large pin 11 and small pin 12 is adopted in terms of heat dissipation, such as figure 1 As shown, it is no longer the traditional design of two equal pins. figure 1 It is a schematic diagram of the pins of LED 1. The two pins of the LED 1 correspond to pole A and pole K respectively, and the pin of pole K is much larger than the pin of pole A, that is, the pin of...

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PUM

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Abstract

The invention discloses a tin-printed steel net. The tin-printed steel net comprises an opening part corresponding to the bonding pad part on a substrate. The opening part comprises a horn-shaped first opening which corresponds to a big bonding pad of the bonding pad part. A first narrow end of the first opening is arranged on the inner side of the big bonding pad. A first wide end of the first opening is extended to the outside of the big bonding pad. A horn-shaped second opening corresponds to a small bonding pad of the bonding pad part. A second narrow end of the second opening is arranged inside the small bonding pad. A second wide end of the second opening is extended to the outside of the small bonding pad. The invention also discloses a bonding pad structure. The tin-printed steel net adopts a horn-shaped opening structure and thus the tin amount is not excessive or too little after brushing a solder paste. The tin-printed steel net and the bonding pad structure improve the yield of SMT, and solve problems that the current LED steel net which have small and big pins is thin and light and is easy to bias, incline, arch, perk and even roll over and also solve problems of bottom false soldering.

Description

technical field [0001] The invention belongs to the technical field of SMT, and in particular relates to a tin printing steel mesh and a pad structure. Background technique [0002] LED is called the fourth-generation lighting source or green light source. It has the characteristics of energy saving, environmental protection, long life, and small size. It is widely used in various indications, displays, decorations, backlights, general lighting, and urban night scenes. According to different functions, it can be divided into five categories: information display, signal lights, vehicle lamps, LCD backlight, and general lighting. With the high brightness and thinning of backlight products, the LEDs used in backlights are also developing towards high brightness and ultra-thin shapes, but the heat generation and heat dissipation problems of LEDs follow. [0003] At present, when designing this kind of thin and bright LED in the industry, the large and small pins are used for he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K1/11
CPCH05K1/111H05K3/341H05K2201/10106H05K2201/09372H05K2203/04
Inventor 戴佳民周福新
Owner TRULY SEMICON
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