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Flexible and pneumatic polishing method of silicon wafers

A silicon wafer polishing and flexible technology, used in surface polishing machine tools, grinding/polishing equipment, metal processing equipment, etc., can solve the problems of fragile and high hardness of silicon wafers, and achieve the effect of easy adjustment

Inactive Publication Date: 2017-12-26
CHINA JILIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a flexible pneumatic polishing method for silicon wafers, which solves the problem that silicon wafers are easily broken due to high hardness in the polishing process

Method used

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  • Flexible and pneumatic polishing method of silicon wafers

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Experimental program
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Effect test

Embodiment

[0021] Embodiment: a kind of flexible pneumatic polishing method of silicon wafer, comprises the following steps: (1), silicon wafer 3 is fixed on the workbench 4 by waxing machine; Air, the air pressure is 10kpa; (3), rotate the flexible pneumatic polishing disc 1, inject polishing liquid 2 between the flexible pneumatic polishing disc 1 and the silicon wafer 3 simultaneously, and rotate the silicon wafer 3 to polish the silicon wafer 3; (4 ), repeat step (3) to polish, and the polishing time is 12min. The flexible pneumatic polishing disc plays the role of flexible polishing, improving the surface precision and flatness of silicon wafer polishing.

[0022] The polishing of the silicon wafer 3 is as follows: the silicon wafer 3 is rotated and polished with the rotation of the working table 4; the rotating speed of the flexible pneumatic polishing disc 1 is 45 rpm. The rotation speed of 45rpm is a suitable polishing speed during the polishing process of silicon wafers, which ...

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Abstract

The invention discloses a flexible and pneumatic polishing method of silicon wafers. The flexible and pneumatic polishing method comprises the following steps: (1) fixing silicon wafers on a working table through a waxing machine; (2) introducing compressed air into a flexible and pneumatic polishing disc, and controlling the air pressure to be 1-15 kpa; (3) rotating the flexible and pneumatic polishing disc, meanwhile injecting a polishing solution into the part between the flexible and pneumatic polishing disc and the silicon wafers, and further rotating the silicon wafers to polish the silicon wafers; and (4) repeating the step (3) for polishing, and controlling the polishing time to be 10-15 min. With the adoption of the method for processing the silicon wafers, the problem that the silicon wafers are easy to broke and crack during the polishing process is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor polishing, in particular to a flexible pneumatic polishing method for silicon wafers. Background technique [0002] Semiconductor silicon wafer is the main substrate material of modern ultra-large-scale integrated circuits. It is generally an integrated circuit-level semiconductor silicon wafer manufactured through processes such as crystal pulling, slicing, chamfering, diaphragm, corrosion, polishing, and cleaning. Among them, the polishing process is a very important process in the subsequent processing process, and its processing accuracy directly affects the surface quality of the silicon wafer. [0003] At present, there are many polishing methods for silicon wafers, and the traditional polishing method is mechanical polishing. The most mature and widely used polishing technology is chemical mechanical polishing, which combines mechanical friction and chemical corrosion to obtain silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B29/02
CPCB24B1/00B24B29/02
Inventor 董飞李琛
Owner CHINA JILIANG UNIV
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