Flexible and pneumatic polishing method of silicon wafers

A silicon wafer polishing and flexible technology, used in surface polishing machine tools, grinding/polishing equipment, metal processing equipment, etc., can solve the problems of fragile and high hardness of silicon wafers, and achieve the effect of easy adjustment

Inactive Publication Date: 2017-12-26
CHINA JILIANG UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a flexible pneumatic polishing method for silicon wafers, which solves the problem that silicon wafers are easily broken due to high hardness in the polishing process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible and pneumatic polishing method of silicon wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0021] Embodiment: a kind of flexible pneumatic polishing method of silicon wafer, comprises the following steps: (1), silicon wafer 3 is fixed on the workbench 4 by waxing machine; Air, the air pressure is 10kpa; (3), rotate the flexible pneumatic polishing disc 1, inject polishing liquid 2 between the flexible pneumatic polishing disc 1 and the silicon wafer 3 simultaneously, and rotate the silicon wafer 3 to polish the silicon wafer 3; (4 ), repeat step (3) to polish, and the polishing time is 12min. The flexible pneumatic polishing disc plays the role of flexible polishing, improving the surface precision and flatness of silicon wafer polishing.

[0022] The polishing of the silicon wafer 3 is as follows: the silicon wafer 3 is rotated and polished with the rotation of the working table 4; the rotating speed of the flexible pneumatic polishing disc 1 is 45 rpm. The rotation speed of 45rpm is a suitable polishing speed during the polishing process of silicon wafers, which ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle size (mesh)aaaaaaaaaa
particle size (mesh)aaaaaaaaaa
Login to view more

Abstract

The invention discloses a flexible pneumatic polishing method for a silicon wafer, which comprises the following steps: (1), fixing the silicon wafer on a workbench through a wax sticking machine; (2), feeding compressed air into the flexible pneumatic polishing disc, The air pressure is: 1-15kpa; (3), rotate the flexible pneumatic polishing disc, inject polishing liquid between the flexible pneumatic polishing disc and the silicon wafer at the same time, and rotate the silicon wafer to polish the silicon wafer; (4), repeat the steps ( 3) Polishing, the polishing time is 10-15min. The silicon wafer is processed by the process method, which solves the problem that the silicon wafer is easily broken in the polishing process.

Description

technical field [0001] The invention relates to the technical field of semiconductor polishing, in particular to a flexible pneumatic polishing method for silicon wafers. Background technique [0002] Semiconductor silicon wafer is the main substrate material of modern ultra-large-scale integrated circuits. It is generally an integrated circuit-level semiconductor silicon wafer manufactured through processes such as crystal pulling, slicing, chamfering, diaphragm, corrosion, polishing, and cleaning. Among them, the polishing process is a very important process in the subsequent processing process, and its processing accuracy directly affects the surface quality of the silicon wafer. [0003] At present, there are many polishing methods for silicon wafers, and the traditional polishing method is mechanical polishing. The most mature and widely used polishing technology is chemical mechanical polishing, which combines mechanical friction and chemical corrosion to obtain silic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B29/02
CPCB24B1/00B24B29/02
Inventor 董飞李琛
Owner CHINA JILIANG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap