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Substrate holder and method for joining two substrates

一种固持器、衬底的技术，应用在电固体器件、半导体/固态器件制造、半导体器件等方向

Active Publication Date: 2021-02-23
EV GRP E THALLNER GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Consequently, the bonding wave is subjected to different temperatures at different times or in other words at different locations, and thus produces the above-mentioned sticking out defect

Method used

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  • Substrate holder and method for joining two substrates
  • Substrate holder and method for joining two substrates
  • Substrate holder and method for joining two substrates

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no. 5 approach

[0200] Figure 5 shows a substrate holder 1 according to the invention IV According to a fifth embodiment of the present invention, the substrate holder 1 IV Apart from image 3 In addition to the features mentioned in there are recesses 9 filled with pegs and / or needles and / or pedestals 10 in order to minimize contact between the not shown back side of the not shown first substrate 11' , and ensure that the first substrate 11 is fully supported to the greatest extent. This minimization also serves to avoid (especially metallic) contamination. The recess 9 may be flooded with a fluid having a high heat capacity and / or thermal conductivity to improve thermal coupling.

[0201] Figure 6a A first step of an exemplary method according to the invention is shown, wherein initially the first, upper substrate 11 is at a distance d1 from the second, lower substrate 11'. This process step takes place in the previously defined region a of the associated T-t diagram. The substrate...

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Abstract

A substrate holder (1, 1', 1'', 1''', 1 IV ) having a fixing surface (4o) for holding the substrate (11, 11').

Description

technical field [0001] The present invention relates to substrate holders, systems with such substrate holders, applications of such substrate holders, methods and products for joining two substrates, in particular substrate stacks produced by such methods And such a substrate holder is directed to the application of such a method. Background technique [0002] In the semiconductor industry, substrates, especially wafers, are aligned and connected to each other using different methods. The process of joining is called bonding. Depending on the materials to be joined, different joining techniques must be applied in order to achieve the best results. [0003] Thus, metals are joined to each other, eg by diffusion processes at high temperature and pressure, although techniques for joining at room temperature have also gained acceptance in recent years. [0004] The surface atoms preferably form covalently bonded substrates directly to each other by adhesive forces. Adhesion...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67109H01L21/187H01L21/67346H01L21/68H01L24/80
Inventor T.瓦根莱特纳T.普拉赫J.M.聚斯J.马林格
Owner EV GRP E THALLNER GMBH
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