Manufacturing method of vapor chamber and vapor chamber
A manufacturing method and a technology for a vapor chamber, applied in the field of materials, can solve the problems of high powder sintering and sintering temperature, different performance of the vapor chamber, poor stability, etc., so as to reduce energy consumption and cost, avoid high temperature sintering, and facilitate batch production. production effect
Active Publication Date: 2019-07-23
中微冷却技术(深圳)有限公司
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Problems solved by technology
However, the sintering temperature of powder sintering is high, labor-intensive and time-consuming, and powder sintering is difficult to shape, and the batch consistency of sintering compaction effect cannot be guaranteed, resulting in differences in the performance of each batch of vapor chambers and poor stability.
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[0033] In describing the present invention, it is to be understood that the terms "central", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device Or elements must have a certain orientation, be constructed and operate in a certain orientation, and thus should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these featu...
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The invention discloses a uniform-temperature board manufacturing method. The uniform-temperature board manufacturing method comprises the following steps that a core material which is a foam materialwith the porosity of 60-200 PPi is machined and formed; a communication hole is machined in a box; a communication pipe is mounted in a liquid injection hole and then fixed and sealed with adhesives;the machined and formed core material is mounted in the box, a cover plate is mounted, and the box is sealed; a cavity of the box is vacuumized through the communication pipe, and working media are injected into the cavity of the box; and the communication pipe is sealed. According to the uniform-temperature board manufacturing method, a uniform-temperature board is manufactured by machining andforming the core material and then inlaying the core material into the cavity, so that the problems of high-temperature sintering and the like are solved, energy consumption and cost are reduced, andthe performance of the uniform-temperature board is improved; and volume production is facilitated, and the yield is increased.
Description
technical field [0001] The invention relates to the field of material technology, and more specifically, to a method for manufacturing a vapor chamber and a vapor chamber. Background technique [0002] In terms of heat dissipation technology, the traditional copper-aluminum heat dissipation technology is increasingly unable to meet our growing power heat dissipation needs. The current cooling technology has involved various methods. In the face of severe thermal problems, especially military high-power equipment with high power density and difficulty in uniform temperature dissipation, the most effective method at present is to use the vapor chamber technology produced by the principle of phase change to produce better and more stable uniform temperature heat dissipation products It is a subject of continuous research in the field of electronic heat dissipation, and the production methods of the vapor chamber have different performance levels. [0003] Most of the existing ...
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IPC IPC(8): F28D15/02F28D15/04H05K7/20
Inventor 王彬
Owner 中微冷却技术(深圳)有限公司