Array jet and solid-liquid phase change coupling-based electronic device heat dissipation method

A technology of array jets and electronic devices, applied in cooling/ventilation/heating transformation, etc., can solve the problems of unstable gas-liquid phase transition process, large system pressure drop power consumption, high sealing requirements, etc., and achieve stable heat exchange mode. , the effect of increasing the equivalent heat capacity and improving the heat transfer performance

Active Publication Date: 2018-01-09
TAIYUAN UNIV OF TECH
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Problems solved by technology

Although the heat exchange effect of this method is significantly improved, because it adopts the gas-liquid phase change method, the pressure of the working medium needs to be controlled within a certain range, so the overall sealing performance o

Method used

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  • Array jet and solid-liquid phase change coupling-based electronic device heat dissipation method
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  • Array jet and solid-liquid phase change coupling-based electronic device heat dissipation method

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Embodiment

[0037] Such as figure 1 shown. The heat transfer performance is studied through two-dimensional numerical simulation. The physical model of the present invention adopts an array jet structure composed of three groups of nozzles. The nozzle diameter D is 1mm, the array hole spacing S is 5mm, and the jet spacing H is 10mm. The mobile working medium considers pure water and phase change nanocapsule suspension respectively for comparative test, wherein the volume percentage of phase change nanocapsule particles 7 in the phase change nanocapsule suspension is 28%, and the phase change capsule core in a single phase change nanocapsule particle The mass percentage is 48.6%, the average diameter of the capsule particles is 100nm, the latent heat of phase change of the suspension is 31.2kJ / kg, the phase change temperature range is 27-29°C, the volume flow rate of a single nozzle is 0.94L / min, the heating surface The heat flux is 400W / cm 2 .

[0038] Figure 5 is the temperature dis...

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Abstract

The invention belongs to the technical field of electronic device heat dissipation methods, and particularly relates to an array jet and solid-liquid phase change coupling-based electronic device heatdissipation method. The method solves a high heat flux heat dissipation problem of a high-power electronic device. The method is carried out through an array jet structure, a flow working medium forthe method is a phase change nano capsule suspension, and the phase change nano capsule suspension and a target object exchange heat, so as to control the temperature of the target object. According to the method, the phase change nano capsule suspension is used in submerged array jet impact heat exchange, solid-liquid phase change heat exchange of a phase change capsule core and a disturbance action of a nano capsule particle can improve the heat exchange performance of the array jet remarkably, so as to meet the heat dissipation demand of the target object under a high heat flux condition. The solid-liquid phase change enhanced heat exchange manner used in the invention is relatively stable, and the heat dissipation structure is simpler.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation methods for electronic devices, and in particular relates to a heat dissipation method for electronic devices coupled with array jets and solid-liquid phase transitions. Background technique [0002] With the continuous development of micromachining level, electronic devices are gradually developing towards the direction of miniaturization, high integration and high operating frequency, which makes the heat flux density increase rapidly during operation, which can be as high as 100W / cm 2 , therefore, adopting an efficient and reliable cooling scheme to achieve thermal control of electronic devices is crucial to ensure their safe operation. [0003] The jet impingement is to impinge the flowing working fluid on the target object through the nozzle at high speed. Due to the high-speed action of the fluid, the boundary layer near the stagnation point of the target object is very thin, which ...

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Application Information

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IPC IPC(8): H05K7/20
Inventor 张嘉杰阴继翔马素霞王磊
Owner TAIYUAN UNIV OF TECH
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