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Device for copper column gate array interconnection device column implanting process

A grid array and device technology, which is applied in the field of copper column grid array interconnection device column planting process devices, and the field of column planting process devices, can solve the problem of increasing production cycle and cost, and difficulty in achieving high-precision centering and positioning and welding of welding columns. Columns are easily scratched, etc., to achieve high interconnection quality and interconnection efficiency, achieve interconnection quality and interconnection efficiency, and ensure the effect of coplanarity

Active Publication Date: 2018-01-19
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention solves the problems that the existing post-planting device and the post-planting method adopted by the post-planting method are easy to be scratched, difficult to achieve high-precision centering and positioning of the welding post, and different specifications of devices need to be customized to increase the production cycle and cost. A device for pillar planting process of copper pillar grid array interconnection device is proposed

Method used

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  • Device for copper column gate array interconnection device column implanting process
  • Device for copper column gate array interconnection device column implanting process
  • Device for copper column gate array interconnection device column implanting process

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specific Embodiment approach 1

[0020] Specific implementation mode one: combine Figure 1 to Figure 5 To illustrate this embodiment, a device for the pillar planting process of copper pillar grid array interconnection devices described in this embodiment includes a drill chuck translational movement mechanism, a drill chuck rotational movement assembly, a stage assembly, and a feeding assembly. The drill chuck rotary motion assembly is installed on the drill chuck translational motion mechanism, the drill chuck rotary motion assembly is arranged above the stage assembly, and the feeding assembly is arranged on the drill chuck The head turns to one side of the motion assembly. The automatic separation of a single copper column, the flux coating at the end of the copper column and the continuous automatic delivery of the copper column to the designated position are realized through the feeding assembly; The orderly movement of the stage assembly realizes the clamping action of the copper pillar at the specif...

specific Embodiment approach 2

[0021] Specific implementation mode two: combination Figure 4 Describe this embodiment mode. The drill chuck rotation movement assembly of a device used for the pillar planting process of copper pillar grid array interconnection devices described in this embodiment includes a horizontal connecting plate 24, a numerical control motor 25, a motor tensioning plate 26, Driving wheel 27, driven wheel 28, conveyor belt 29, rotating shaft and drill chuck 30, CNC motor 25 is installed on the horizontal connecting plate 24 through motor tension plate 26, and driving wheel 27 is sleeved on the rotating shaft of CNC motor 25 , the driven wheel 28 is sleeved on the upper end of the rotary shaft 30 where the drill chuck is located, and the driving wheel 27 is connected with the driven wheel 28 through a conveyor belt 29 .

[0022] The numerical control motor 25 drives the driving wheel 27 to rotate, and the driving wheel 27 drives the driven wheel 28 to rotate through the conveyor belt 29...

specific Embodiment approach 3

[0024] Specific implementation mode three: combination Figure 4 To illustrate this embodiment, the drill chuck translational motion mechanism of a device for the pillar planting process of copper pillar grid array interconnection devices described in this embodiment includes a vertical base plate 11, an X-direction motion component, and a Z-direction motion assembly. Motion assembly, the X-direction motion assembly includes X-direction linear guide rail 12, X-direction rack 13, X-direction motion gear 14, CNC motor 15, X-direction motion slider 16 and vertical connecting plate 17, X-direction linear guide rail 12 and the X-direction rack 13 are installed side by side in parallel on the vertical base plate 11 from top to bottom, and the vertical connecting plate 17 is slidingly connected with the X-direction linear guide rail 12 through the X-direction moving slider 16, and the CNC motor 15 can be installed on the On the vertical connection plate 17, the X-direction motion gea...

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Abstract

A device for the copper column gate array interconnection device column implanting process is disclosed. The invention relates to a column implanting process device and particularly relates to a device for the copper column gate array interconnection device column implanting process. The invention aims to solve problems that a welding column is easy to be scratched, the high precision centering and positioning of the welding column are difficult, and the customization of different molds is needed by different specifications of devices and production cycle and cost are increased according to anexisting column implanting device and a used column implanting method. The device comprises a drill chuck translation movement mechanism, a drill chuck rotation movement assembly, an object stage assembly and a feeding assembly, the drill chuck rotation movement assembly is installed on the drill chuck translation movement mechanism, the drill chuck rotation movement assembly is arranged above the object stage assembly, and the feeding assembly is arranged at a side of the drill chuck rotation motion assembly. The device belongs to the field of electronic products.

Description

technical field [0001] The invention relates to a pillar planting process device, in particular to a device for the pillar planting process of copper pillar grid array interconnection devices, which belongs to the field of electronic products. Background technique [0002] The ceramic post grid array interconnection refers to the arrangement of solder post interconnection arranged in an array on the chip carrier substrate to realize the mechanical connection and electrical connection between the integrated circuit on the chip and the external components. This form of interconnection is characterized by high interconnection density and high reliability. In the originally developed ceramic post grid array interconnection device, the material of the solder posts arranged in an array is high-lead solder, and the two ends of the solder post are respectively connected to the chip carrier substrate and the printed circuit board by soldering. on the pads arranged in the upper array...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/60
Inventor 赵智力杨涛李睿白宇慧
Owner HARBIN UNIV OF SCI & TECH
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