A method for improving layer deviation of multilayer circuit board

Abstract

The invention relates to a layer deviation improvement method of a multi-layer circuit board. The layer deviation improvement method comprises the following steps of S1, pattern fabrication; S2, polyethylene (PE) punching machine; S3, lamination in advance; S4, combination; S5 board lamination; S6, hot-pressing; and S7, X-RAY target drilling. Inner-layer control is performed during pattern fabrication and comprises a, a film is controlled according to a data form, boards with same material number and different dates in a dustless room of an inner layer are distinguished and placed according to marks, and etching is distinguished and performed on boards according to numbers; and b, the expansion and contraction control of an inner-layer film is within + / -1 millimeter, and an etching boardis controlled according to + / -3 millimeters. By analyzing a layer deviation reason of the circuit board, a corresponding method is set to control, the layer deviation of the circuit board is improvedmainly by inner-layer film control, expansion and contraction stack of the PE punching machine, lamination matching production of an expansion and contraction board and production condition control, and the production quality is improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a method for improving layer deviation of a multilayer circuit board. Background technique [0002] Due to the increase in the packaging density of integrated circuits, the interconnection lines are highly concentrated. So that multi-layer circuit boards are widely used. The multi-layer circuit board is to press the inner layer circuit board, prepreg and outer layer copper foil through the high temperature and high pressure process of the press, and then connect the layers of the circuit through the through hole to realize the electrical performance. This requires that the relative position accuracy between the overlapping points of the copper foil of each layer of the circuit and the hole is high, otherwise a large deviation will cause a short circuit or an open circuit and be scrapped. Therefore, achieving accurate alignment between layers is crucial for multilayer cir...

AI Technical Summary

Problems solved by technology

Among them, the pressing is carried out under the condition of high temperature and high pressure of the press, and it is easy to cause layer deviation to be scrapped. However, the board has already been pressed and formed, so no analysis is made.