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A kind of etching method of silver-copper solder

An etching and soldering technology, applied in the field of surface treatment, can solve the problems of removal, device reliability impact, foaming ratio, etc., to reduce environmental pollution, improve the working environment, and achieve remarkable effects.

Active Publication Date: 2019-11-12
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1) The brazing appearance of the shell does not meet the requirements, and the size is poor;
[0004] 2) The number of holes in the solder layer and the inclusion of impurities increase, and these impurities cannot be cleaned up during subsequent plating, resulting in an increase in the proportion of peeling and blistering after plating;
[0005] 3) The coating cannot fully wrap the solder well, resulting in the problem of silver migration;
[0006] 4) It may have a certain impact on other reliability of the device
However, there is currently no good way to etch the silver-copper solder specifically or preferentially so that the solder is removed from all parts of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A method for etching silver-copper solder, comprising the following steps:

[0039] ①Alkaline degreasing

[0040] Alkaline degreasing is an aqueous solution, which contains 40 g / L chemical degreasing powder, and the brazed semi-finished shell is placed in an alkaline degreasing solution at 60°C for 5 minutes;

[0041] ②Washing

[0042] Rinse the shell after alkaline degreasing with tap water for 3 minutes, and then wash it with deionized water for 3 minutes;

[0043] ③Pickling

[0044] The pickling solution is an aqueous solution, which contains: 5mL / L of OP emulsifier, 75g / L of thiourea, and 100mL / L of sulfuric acid. Put the washed shell into the pickling solution at 60°C for 5 minutes;

[0045] ④washing

[0046] Rinse the shell after alkaline degreasing with tap water for 3 minutes, and then wash it with deionized water for 3 minutes;

[0047] ⑤ drying

[0048] Use a 100°C high-temperature blast drying oven to dry the washed shell at high temperature;

[0049] ...

Embodiment 2

[0052] A method for etching silver-copper solder, comprising the following steps:

[0053] ①Alkaline degreasing

[0054] Alkaline degreasing is an aqueous solution, which contains 60 g / L chemical degreasing powder, and the brazed semi-finished shell is placed in an alkaline degreasing solution at 80°C for 15 minutes;

[0055] ②Washing

[0056] Rinse the shell after alkaline degreasing with tap water for 5 minutes, and then wash it with deionized water for 5 minutes;

[0057] ③Pickling

[0058] The pickling solution is an aqueous solution, which contains: 10mL / L OP emulsifier, 150g / L thiourea, and 200mL / L sulfuric acid. Put the washed shell into the pickling solution at 80°C for 15 minutes;

[0059] ④washing

[0060] Rinse the shell after alkaline degreasing with tap water for 5 minutes, and then wash it with deionized water for 5 minutes;

[0061] ⑤ drying

[0062] Use a high-temperature blast drying oven at 120°C to dry the shell after washing at high temperature;

[0...

Embodiment 3

[0066] A method for etching silver-copper solder, comprising the following steps:

[0067] ①Alkaline degreasing

[0068] Alkaline degreasing is an aqueous solution, which contains 50 g / L chemical degreasing powder, and the brazed semi-finished shell is placed in an alkaline degreasing solution at 70°C for 10 minutes;

[0069] ②Washing

[0070] Rinse the shell after alkaline degreasing with tap water for 4 minutes, and then wash it with deionized water for 4 minutes;

[0071] ③Pickling

[0072] The pickling solution is an aqueous solution, which contains: 7mL / L OP emulsifier, 115g / L thiourea, and 150mL / L sulfuric acid. Put the washed shell into the pickling solution at 70°C for 10 minutes;

[0073] ④washing

[0074] Rinse the shell after alkaline degreasing with tap water for 4 minutes, and then wash it with deionized water for 4 minutes;

[0075] ⑤ drying

[0076] Use a high-temperature blast drying oven at 110°C to dry the shell after washing at high temperature;

[00...

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Abstract

The invention relates to an etching method for silver-copper solder, which comprises the following steps: (1) Alkaline degreasing: put the brazed semi-finished shell into an alkaline degreasing solution for cleaning; (2) Washing: first rinse with tap water, and then Clean it with deionized water; (3) pickling: put the washed shell into the pickling solution to clean; (4) dry; use a high-temperature blast drying box to dry the washed shell at high temperature; (5) ) Etching: Put the casing into the etching solution; (6) After the etching is completed, take out the casing and repeat the process step (2) washing with water, and step (4) drying. Advantages: 1) There is no corrosion damage to the etching of silver-copper solder, and the shell brazing shape, size, solder coverage and subsequent plating reliability are high. 2) Slow down the etching process, increase the range of etching time, 3) reduce environmental pollution; 4) low cost, simple and easy to implement; 5) solve the "silver migration" problem of the RF power device casing, the effect is remarkable.

Description

technical field [0001] The invention relates to an etching method of silver-copper solder, which belongs to the technical field of surface treatment. Through the method, the silver-copper solder can be selectively removed from all positions of the whole. This method is especially useful for obtaining the desired shell brazing shape, size, solder coverage and subsequent plating reliability. In addition, this method is especially critical as a pre-treatment for products with "silver migration" requirements . Background technique [0002] Silver-based solder is the longest and most widely used type of solder in solder. Especially the Ag-Cu eutectic (Ag72-Cu28) solder is currently the most widely used solder in the soldering process of electronic packaging devices. It has a low melting point, no crystallization interval, good fluidity, and the thermal conductivity and electrical conductivity of the formed weld Good performance, so in the manufacture of electronic packaging com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/44
Inventor 解瑞程凯谢新根杨建陈宇宁
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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