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Large-area two-dimensional transition-group metal-compound film with controllable layers and a preparation method thereof

A transition metal and oxide thin film technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem that two-dimensional materials cannot be prepared in large areas, and achieve precise and controllable deposition thickness and good film uniformity. Effect

Inactive Publication Date: 2018-02-06
FUDAN UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] The present invention can prepare large-area transition metal compound thin films with single-layer to three-layer layers according to needs, which breaks through the current limitation that two-dimensional materials cannot be prepared in large areas, and is expected to be applied in the production of large-scale integrated circuits in the future

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  • Large-area two-dimensional transition-group metal-compound film with controllable layers and a preparation method thereof
  • Large-area two-dimensional transition-group metal-compound film with controllable layers and a preparation method thereof
  • Large-area two-dimensional transition-group metal-compound film with controllable layers and a preparation method thereof

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Embodiment Construction

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals represent the same or similar materials or methods having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. To simplify the disclosure of the present invention, the materials and methods of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art will recognize the applicability of other processes and / or the use of other materials.

[0023] Hereinafter, the preparation method of the two-dimensional transition metal compound thin film involved in the present invention w...

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Abstract

The invention, which belongs to the technical field of film preparation, in particular relates to a large-area two-dimensional transition-group metal-compound film with controllable layers and a preparation method thereof. The basic chemical-combination chemical formula of the transition-group metal-compound film is MX2, wherein the M expresses a V-group element and the X expresses a sulfur-groupelement. The preparation method comprises: a precursor is deposited on a substrate; and then chemical vapor deposition reaction is carried out to form a transition-group metal compound, wherein a metal M layer is deposited by using physical vapor deposition and electron beam evaporation deposition or oxide or nitride of the metal M is deposited by atomic layer deposition and molecular beam epitaxydeposition. According to the invention, a large-area two-dimensional film with controllable layers is prepared, so that the limitation that the exiting two-dimensional transition-group metal-compoundfilm can not be prepared currently is eliminated. Therefore, the large-area two-dimensional transition-group metal-compound film and the preparation method thereof are expected to be applied in a large-scale integrated circuit.

Description

technical field [0001] The invention belongs to the technical field of film preparation, and in particular relates to a large-area transition metal compound film and a preparation method thereof, in particular to a large-area transition metal compound film with a controllable number of layers and a preparation method thereof. Background technique [0002] With the development of semiconductor technology, the feature size of semiconductor devices is getting smaller and smaller. At present, the device size has been reduced to 14nm. When the node size is reduced to a certain limit, new technologies are needed to break through the limit. Since the discovery of graphene, two-dimensional materials have received more and more attention, but so far, due to the structural characteristics of graphene, they cannot be applied to the manufacture of actual semiconductor transistors. At this time, two-dimensional transition metal compounds (TMDCs ) into people's eyes. [0003] Monolayer T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L29/24
Inventor 周鹏刘春森张卫
Owner FUDAN UNIV
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