Wire arch detecting method and device in photovoltaic silicon wafer cutting process

Abstract

The invention provides a line arch detecting method and device in the photovoltaic silicon wafer cutting process, and the problems that in the prior art, precision is insufficient, and operation is not convenient can be solved. According to the line arch detecting device, a telephoto lens with a transparent scaleplate is fixedly arranged outside a photovoltaic silicon wafer cutting work area, anda cross-shaped mark is arranged in the center of the lens. The line arch observation view angle of the telephoto lens is set as theta, calculation is conducted through measurement of the horizontal distance L0 between the telephoto lens and the intersection point of a cutting line net and a silicon bar and the height h0 relative to the cutting line net and the theta and h corresponding relation embodied according to the formula: h=L0tan<theta>-h0, the longitudinal height value is marked on the transparent scaleplate, direct observation is conducted, and the line arch value h is obtained. According to the line arch detecting method and device, the detection result is accurate, wherein precision is 1mm; during detection, repeated cutting bin opening and closing in the cutting process are notneeded; and meanwhile, continuous observation is achieved, and the detection difficulty of technicists is greatly lowered.

Description

technical field [0001] The invention relates to a method and a device for detecting wire bows in the cutting process of hard and brittle materials. Background technique [0002] Photovoltaic silicon wafers are usually manufactured by multi-wire cutting of silicon rods, and the size of the wire bow in the cutting process is a very critical parameter. At present, it is generally approximated by visual observation of the cutting process, and then the stability of the cutting process, the cutting force of the cutting wire (electroplated diamond wire), and the matching degree of the cutting process are evaluated, judged, and adjusted. The so-called wire bow refers to the longitudinal distance between the intersection point of the wire mesh and the silicon rod from the original position. [0003] The main disadvantages of the existing wire bow detection are: visual inspection (long distance, estimated, inaccurate; different observers have large differences); need to open and clos...

AI Technical Summary

Problems solved by technology

[0004] In order to effectively solve the problems of insufficient precision and inconvenient operation existing in the prior art, the present invention proposes a method and device for detecting wire bows during the cutting process of photovoltaic silicon wafers

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