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Loudspeaker with heat radiation function

A loudspeaker and functional technology, which is applied in the field of loudspeakers with heat dissipation function, can solve the problems of limited adsorption capacity, speaker damage, heat loss, etc., and achieve the effect of improving sound quality and reducing noise

Inactive Publication Date: 2018-02-09
温州华大信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, people have put forward higher requirements on the acoustic performance of the speaker; the speaker of the related technology structure mainly includes a casing and a sound-generating device accommodated in the casing. In order to improve the sound quality, the usual practice is to Filled with sound-absorbing materials such as zeolite molecular sieves, but the skeleton structure of zeolite or molecular sieve is mainly composed of silicon or silicon-alumina, which has a great adsorption capacity for nitrogen in the air, but has a limited adsorption capacity for oxygen in the air, making Zeolites or molecular sieves do not exhibit high low frequency performance and are of limited use in improving speaker sound quality
[0003] There are two types of loudspeakers known to people as earphones, which are electrodynamic loudspeakers and piezoelectric loudspeakers. The present invention is suitable for use in earphones. When the earphones are used for a long time, the heat generated will affect the normal operation of the permanent magnets and cannot Effectively dissipate the heat and affect the playback sound quality of the speaker; if you do not pay attention when using it, the earphone will hit the ground or a hard object, resulting in damage to the speaker in the earphone and damage to the electronic components in the speaker, which will affect the sound quality of the speaker

Method used

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  • Loudspeaker with heat radiation function
  • Loudspeaker with heat radiation function

Examples

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Embodiment 1

[0023] Embodiment 1 refers to Figure 1-2 , a loudspeaker with a heat dissipation function, including a housing 1, a paper cone 2, a chassis and a fixed connector, the housing 1 is in the shape of a circular platform, and the inside of the housing 1 is in a cavity state, and the upper part of the housing 1 The bottom surface is in a penetrating state, the lower bottom surface is in a sealed state, the area of ​​the upper bottom surface is larger than the area of ​​the lower bottom surface, and a heat dissipation assembly is provided in the housing 1, and the heat dissipation assembly is composed of a heat dissipation fin 22 and a fixing device 23; the paper cone 2 And the bottom frame is arranged in the shell 1, the bottom frame is located at the bottom of the paper cone 2, and its bottom frame is composed of two cylinders, called the first cylinder 3 and the second cylinder 4, the cross-sectional area of ​​the first cylinder 3 Greater than the cross-sectional area of ​​the se...

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Abstract

A loudspeaker with a heat radiation function comprises a housing, a paper cone, an underframe, and a fixed connector; the housing is in a circular terrace shape, and a cavity is formed inside the housing; the housing upper undersurface is in a through state, the lower undersurface is in a sealed state, wherein the upper undersurface area is bigger than the lower undersurface area; a heat radiationassembly is arranged in the housing, and comprises radiating fins and a fixed device; the paper cone and the underframe are arranged in the housing; the underframe is arranged on the bottom of the paper cone, and comprises two cylinders called the first and second cylinders; the paper cone comprises a cone rack, a vibrating diaphragm, a dust shield, a static core support chip, and a voice coil; apermanent magnet is arranged on the paper cone bottom; the cone rack is a metal rack; a damping device is arranged on the housing upper undersurface; the loudspeaker has the heat radiation effect.

Description

technical field [0001] The invention belongs to the technical field of loudspeaker manufacturing technology in integrated circuits, and in particular relates to a loudspeaker with heat dissipation function. Background technique [0002] Loudspeaker is also called "horn"; it is a very commonly used electro-acoustic transducer device, which can be seen in electronic and electrical equipment that emits sound; with the rapid development of electronic information technology, more and more electronic products are applied to Loudspeakers are used as their sound-generating components, such as mobile phones, laptops, etc. Nowadays, people have put forward higher requirements on the acoustic performance of the speaker; the speaker of the related technology structure mainly includes a casing and a sound-generating device accommodated in the casing. In order to improve the sound quality, the usual practice is to Filled with sound-absorbing materials such as zeolite molecular sieves, bu...

Claims

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Application Information

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IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/06H04R9/02H04R2400/11
Inventor 张建民
Owner 温州华大信息技术有限公司
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