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Tin alloy for copper alloy hot-plating and preparation method thereof

A technology of tin alloy and copper alloy, which is applied in the field of tin alloy for copper alloy hot-plating and its preparation, can solve the problems of short circuit of electronic connector or integrated circuit board, long residence time at room temperature, etc., and achieve low preparation cost and low melting temperature Effect

Inactive Publication Date: 2019-09-06
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Pure tin should not be directly used in the hot-dip plating process. The main reason is that the long residence time at room temperature or high temperature work will easily cause conductive whiskers to form on the surface of the hot-dip tin material, causing short circuits in electronic connectors or integrated circuit boards. It is of great significance to study tin-based alloys for hot-dip copper alloy materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A tin alloy for copper alloy strip hot-plating, consisting of the following elements in mass fraction: 7.0% Zn, 3.0% Bi, 0.5% Sb, 0.15% Cr, 0.2% Cu, the balance being Sn and Unavoidable impurity elements;

[0025] The preparation method of described tin alloy comprises the following steps:

[0026] (1) Preparation of master alloy:

[0027] Weigh pure Sn and pure Cu according to the mass ratio of 93:7, put them into a water-cooled copper-jacketed vacuum non-consumable melting furnace, evacuate the furnace until the pressure in the furnace is 0.007Pa, then fill it with argon to 0.2-0.3MPa, and arc smelting When the ingredients are completely melted, turn off the electric arc to cool the melt to solidification, turn over the solidified melt, repeat the steps of melting, cooling, and turning over for 3 times to obtain the master alloy SnCu7; the purity of the master alloy SnCu7 is The mass fraction is calculated as: Cu≥6.9%, the balance is Sn;

[0028] Weigh pure Sn and ...

Embodiment 2

[0032] A tin alloy for copper alloy strip hot-plating, consisting of the following elements in mass fraction: 8.0% Zn, 6.5% Bi, 2.0% Sb, 0.30% Cr, 0.25% Cu, the balance being Sn and Unavoidable impurity elements;

[0033] The preparation method is the same as in Example 1; the performance indicators of the prepared tin alloy are: standard electrode potential 0.0878V, melting point 214.5°C, tensile strength 81.73MPa, and elongation 25.9%.

Embodiment 3

[0035]A tin alloy for copper alloy strip hot-plating, consisting of the following elements in mass fraction: 9.0% Zn, 10.0% Bi, 3.5% Sb, 0.5% Cr, 0.3% Cu, the balance being Sn and Unavoidable impurity elements;

[0036] The preparation method is the same as in Example 1; the performance indicators of the prepared tin alloy are: standard electrode potential 0.0775V, melting point 227.4°C, tensile strength 98.6MPa, and elongation 18.3%.

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Abstract

The invention relates to a tin alloy for copper alloy hot galvanizing. The tin alloy consists of the following elements in mass fraction: 1.0-9.0% of Zn, 0.5-10.0% of Bi, 0.3-0.5% of Sb, 0.15-0.9% ofCr, 0.1-0.5% of Cu and the balance of Sn and inevitable impurity elements. Performance indexes of the tin alloy for copper alloy hot galvanizing are as follows: standard electrode potential of 0.0531-0.3017V, a melting point of 203.3-219.5 DEG C, tensile strength of 50.1-98.6MPa and ductility of 18.3-35.7%. The tin alloy is low in preparation cost, and has a melting temperature lower than that ofpure tin; IMC thickness of a hot coating is small, and is small in increasing trend; and cavities and crystal whiskers are liable to generate in use.

Description

technical field [0001] The invention relates to the field of metal coating materials, in particular to a tin alloy for copper alloy hot-plating and a preparation method thereof. Background technique [0002] Tinned copper alloy strips are widely used in high-end fields such as aerospace, military industry, automobiles, communications and electronics. Although my country's copper strip industry continues to develop, tinned copper alloy strips still cannot meet market demand. At present, the research on the structure, performance and production process of the tin-plated layer of copper alloy strips mainly focuses on the research of electro-tin plating. The main advantage of electro-tin plating is that the thickness of the coating metal can be controlled at will, but its production process is cumbersome and the operation requirements are strict. , The price of electroplating equipment is high, and the composition of electroplating solution is complicated. [0003] Hot-dip plat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C13/00C22C13/02C22C1/03C23C2/08
Inventor 田保红刘玉亮张毅殷婷王冰洁孙国强田然张晓辉赵转刘勇贾淑果宋克兴
Owner HENAN UNIV OF SCI & TECH