Ion palladium activating agent

A technology of activators and ions, applied in the field of ionic palladium activators, can solve problems such as poor solution stability, substrate attack, affecting product quality, etc., and achieve good stability

Inactive Publication Date: 2018-02-23
惠州大亚湾金盛科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the activator used in electroless copper plating is colloidal palladium, but as an activator, colloidal palladium has many disadvantages, such as poor solution stability, easy to attack the substrate, and easy to form residues on the copper surface, etc., seriously affecting the product. quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] An ionic palladium activator, the activator components and content are 0.15g of palladium chloride per liter of activator, 4g of aminopyridine, 5g of polyethylene glycol, 5g of sodium hydroxide, and the balance is H2O.

[0014] In the present embodiment, the effect of palladium chloride is to provide metal ion palladium, and aminopyridine is used for adjusting pH value, and polyethylene glycol is used for the hole wall of wetting circuit board, and sodium hydroxide is the complexing agent of metal ion palladium, can The metal palladium is stably dispersed in the solution, and H2O is the dissolving agent. In the remaining embodiments provided by the present invention, the functions of the components are consistent with those of the components in this embodiment.

[0015] The preparation method of the activating agent provided in this embodiment is (taking 1 liter of solvent as an example): take a liquid medicine tank that can be stirred, add H2O, H2O is less than 0.8L, a...

Embodiment 2

[0017] An ionic palladium activator, the components and content of the activator are 0.65g of palladium chloride per liter of the activator, 12g of aminopyridine, 55g of polyethylene glycol, 25g of sodium hydroxide, and the balance is H2O.

Embodiment 3

[0019] An ionic palladium activator, the activator components and content are 0.30g of palladium chloride per liter of activator, 5g of aminopyridine, 5g of polyethylene glycol, 5g of sodium hydroxide, and the balance is H2O.

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PUM

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Abstract

The invention belongs to the technical field of activating agents for circuit board through hole chemical copper plating, and particularly relates to an ion palladium activating agent. The ion palladium activating agent aims at achieving the technical effects of being good in stability, good in coverage, free of attack to base materials and free of residue on copper faces. According to the technical scheme provided for achieving the technical effects, the ion palladium activating agent is per liter prepared from 0.15-0.65g of palladium chloride, 4-12 g of aminopyridine, 5-55 g of polyethyleneglycol, 5-25 g of sodium hydroxide and the balance H2O. The ion palladium activating agent has the beneficial effects that solution stability is good, and palladium ions are good in coverage on glassfiber and resin, free of attract to base materials, quite low in adsorption rate on copper faces and free of residue on the copper faces.

Description

technical field [0001] The invention belongs to the technical field of activators used for electroless copper plating through holes of circuit boards, and in particular relates to an ionic palladium activator. Background technique [0002] Electroless copper plating is a process in the manufacture of circuit boards, usually also called sinking or hole-forming, which is an autocatalytic redox reaction. At present, the activator used in electroless copper plating is colloidal palladium, but as an activator, colloidal palladium has many disadvantages, such as poor solution stability, easy to attack the substrate, and easy to form residues on the copper surface, etc., seriously affecting the product. quality. Therefore it is particularly important to develop a high-quality activator. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an activator with good stability, good coverage, no attack on the substrate, and no r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30
CPCC23C18/30
Inventor 潘恒金
Owner 惠州大亚湾金盛科技有限公司
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