Self-circulating fluid device for heat dissipation of system-on-chip

Abstract

The invention belongs to the field of fluid machinery, and in particular to a self-circulating fluid device for heat dissipation of a system-on-chip. The self-circulating fluid device comprises microchannel radiators, a cooling device, liquid guide pipes and micropumps. The self-circulating fluid device adopts the two micropumps, and utilizes the characteristic that diffusion / contraction tube structures thereof are adopted for generating a net flow difference, so that liquid flows in one direction; the micropump a is connected with the microchannel radiator 1 and the micropump b is connected with the microchannel radiator 2 by means of the liquid guiding pipes separately, so that the liquid forms a one-way circulating flow. Firstly, the micropumps are used for transmitting power, the temperature of the liquid flowing through a heat source chip end is increased, the temperature of the liquid flowing through the cooling device is lowered, the high-temperature liquid and the low-temperature liquid are separated, thereby achieving a better heat dissipation effect; secondly, since main cavity bodies of the two micropumps share the same vibrating diaphragm, the liquid is driven to flow more simply and efficiently. The self-circulating fluid device has better heat dissipation efficiency and high integration degree.

Description

technical field [0001] The invention belongs to the field of fluid machinery, and in particular relates to a self-circulating fluid device used for heat dissipation of a chip-level system. Background technique [0002] With the development of electronic technology, the application of electronic devices tends to be more advanced and miniaturized. In particular, the emergence of silicon integrated circuits has led to a sharp increase in the integration of circuits. For these highly integrated chips, the heat generated by them has increased sharply, resulting in an increase in heat flux, which in turn leads to an increase in the temperature of electronic equipment, thereby disable electronic equipment. According to statistics, among the many factors that cause the failure of electronic equipment and the reduction of its life, high temperature accounts for a large proportion; and the failure of electronic equipment caused by overheating will reduce the performance of the equipm...

AI Technical Summary

Problems solved by technology

In the existing electronic device cooling methods, traditional natural cooling and forced air cooling can no longer meet the thermal control requirements of high-power components, and forced liquid cooling has a higher heat dissipation capacity than forced air cooling

There are many ways to force liquid cooling and heat dissipation, but according to the current comprehensive research, microchannel heat dissipation is a better liquid cooling method, but if the fluid in the microchannel is supplied through an external liquid circuit, the cost will inevitably increase. It is also difficult to form an independent modularization of the heat dissipation system, so it is necessary to add a liquid driving source for the microchannel

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