Ceramic lining plate of power module

Abstract

The invention discloses a ceramic lining plate of a power module. The ceramic lining plate comprises a first metal layer, a second metal layer and a third metal layer which are sequentially arranged from top to bottom, wherein a first ceramic layer is arranged between the first metal layer and the second metal layer, a second ceramic layer is arranged between the second metal layer and the third metal layer, the first metal layer is configured to be an emitter region and a control signal terminal region which are isolated with each other, the second metal layer is configured to be a collectorregion, the second metal layer also can further extend to an upper surface of the first ceramic layer via a through hole, grooves are formed in an upper surface of the lining plate along a thickness direction and are respectively used for installing a first power chip and a second power chip, and the grooves extend to the first metal layer from the first metal layer. By the ceramic lining plate, the technical problems that a circuit interconnection structure of the ceramic lining plate of an existing power module is large in stray inductance, a welding tool is needed to be used during chip welding, a metal liner on a front surface of the lining plate is a combination layer of strong electricity and weak electricity and interconnection between the lining plates is relatively complicated canbe solved.

Description

technical field [0001] The invention relates to the field of manufacturing power semiconductor devices, in particular to a power module ceramic liner structure. Background technique [0002] The substrate 10 is a basic unit structure of a power semiconductor module (such as an IGBT module), and plays multiple functions such as electrical interconnection, electrical insulation, and heat dissipation channels. The vertical structure of the traditional IGBT module liner is as attached figure 1 As shown, the ceramic liner adopts a three-layer structure, that is, one ceramic layer (ceramic layer 12) and two metal layers (front metal layer 11 and back metal layer 13), and the metal layer is isolated by the ceramic layer. The role of the ceramic layer is to insulate, prevent high voltage breakdown, and also play a role in heat dissipation. The function of the front metal layer is to realize circuit interconnection. Usually, the second power chip and the first power chip are placed...

AI Technical Summary

Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a power module ceramic liner to solve the problem that the existing power module ceramic liner circuit interconnection structure has large stray inductance, chip welding needs to use welding tools, and the metal layer on the front side of the liner is strong. The combination layer of electricity and weak electricity, and the technical problems of interconnection between lining boards are relatively complicated

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