Unlock instant, AI-driven research and patent intelligence for your innovation.

Joint connection method and assembly for forming material closure

A technology for connecting components and electrical connecting components, which can be used in welding/welding connection, connection, fixed connection, etc., and can solve problems such as deterioration

Active Publication Date: 2018-03-06
FEW FAHRZEUGELEKTRIKWERK +1
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This problem is exacerbated by coatings, such as colored layers or layers configured as reflective layers, for example with respect to infrared radiation, which are applied multiple times on the relevant contact side of the glass

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Joint connection method and assembly for forming material closure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] According to the figures, a component, in particular a solder base 1 , made of metallic material, in particular a specific alloy, is applied to the printed conductive structure, in particular in the form of a silver layer 2 .

[0041] The electrically conductive structure, that is to say the silver layer 2 , is located on a glass substrate 3 .

[0042] A colored layer 4 is also provided between the silver layer 2 and the glass substrate 3 .

[0043] Thus, the surface of the silver layer 2 and the corresponding underside of the solder base 1 can be regarded as joint surfaces.

[0044]The welded or unsoldered reactive nanomultilayer film 5 is now provided as a reactive nanoscale multilayer system between the joint surfaces.

[0045] When using the soldered nanomultilayer system 5 , the amount of solder 6 is applied on both surface sides.

[0046] When using unsoldered reactive nanomultilayer systems 5 , corresponding solder blanks 6 are formed between the joint surfaces...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a joint connection method; the method applies welded and unsoldered reactive nano-multilayer films between a conductive structure and an electrical connection member on a glass substrate, thus forming material closure; the nano-multilayer film is made of at least two exothermic reaction materials. The method comprises the following steps: first, a reactive film isfirstly prepared corresponding to the mutually opposite bonding surfaces of the conductive structure and the electrical connection member; then, the solder blanks are placed between the correspondingbonding surface and the nano-multilayer film, or additional solder blanks are provided in the already welded nano-multilayer film. The solder blank or the additional solder blank has a larger layer thickness compared to other solder blanks between the nano-multilayer film and the conductive structure applied on the glass substrate, thereby causing a decrease in the temperature input and compensation unevenness to the conductive structure. After a brief application of pressure, the exothermic reaction process of the nano-multilayer film is triggered. The invention also relates to a joint connection assembly.

Description

technical field [0001] The present invention relates to a conductive structure and an electrical connection member, in particular a solder base, for application, in particular printing, on glass substrates by applying soldered and unsoldered reactive (reaktiv) nano-multilayer films A method for forming a material-locked joint connection between the nano-multilayer film made of at least two exothermic reactive materials. The invention also relates to a material-bonded joint connection assembly. Background technique [0002] DE 10 2015 003 086 A1 discloses a method for shortening the process time when welding electrical or electronic components by means of electromagnetic induction heating. In this method, in particular, the electrical contact element is soldered to a solder connection surface applied to a non-metallic substrate, in particular a glass plate. [0003] According to the solution in this document, an electrical contact element designed as a solder base is reali...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/02B23K1/00H01R12/57
CPCB23K1/0008B23K1/0016H01R12/57H01R43/0207B23K1/19B23K2101/38B23K2103/172B23K2103/54B23K1/0006B23K35/001B23K35/0238B23K35/3033C03C27/04H01L2224/40137B23K2101/36
Inventor R·格莱斯贝格B·施奈德A·延里希
Owner FEW FAHRZEUGELEKTRIKWERK