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Method and joint connection assembly for forming a material-bonded joint connection

A technology for connecting components and electrical connecting components, which is applied in the direction of welding/welding connection, connection, fixed connection, etc., and can solve problems such as deterioration

Active Publication Date: 2021-03-23
FEW FAHRZEUGELEKTRIKWERK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This problem is exacerbated by coatings, such as colored layers or layers configured as reflective layers, for example with respect to infrared radiation, which are applied multiple times on the relevant contact side of the glass

Method used

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  • Method and joint connection assembly for forming a material-bonded joint connection

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] According to the figures, a component, in particular a solder base 1 , made of metallic material, in particular a specific alloy, is applied to the printed conductive structure, in particular in the form of a silver layer 2 .

[0041] The electrically conductive structure, that is to say the silver layer 2 , is located on a glass substrate 3 .

[0042] A colored layer 4 is also provided between the silver layer 2 and the glass substrate 3 .

[0043] Thus, the surface of the silver layer 2 and the corresponding underside of the solder base 1 can be regarded as joint surfaces.

[0044]The welded or unsoldered reactive nanomultilayer film 5 is now provided as a reactive nanoscale multilayer system between the joint surfaces.

[0045] When using the soldered nanomultilayer system 5 , the amount of solder 6 is applied on both surface sides.

[0046] When using unsoldered reactive nanomultilayer systems 5 , corresponding solder blanks 6 are formed between the joint surfaces...

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Abstract

The invention relates to a method for forming a material-bonded bonding connection between an electrically conductive structure applied on a glass substrate and an electrical connection component by applying a soldered or unsoldered reactive nano-multilayer film, nano Multilayer films are made from at least two exothermic reactive materials. First, a reactive film is prefabricated corresponding to the mutually opposite joining surfaces of the electrically conductive structure and the electrical connection components. Then, in the unwelded nano-multilayer film, a solder blank is respectively arranged between the corresponding joint surface and the nano-multilayer film, or an additional solder blank is set in the already welded nano-multilayer film, the solder blank or The additional solder blank has a greater layer thickness between the nanomultilayer film and the conductive structure applied on the glass substrate compared to other solder blanks, resulting in a reduced temperature input to the conductive structure and compensation for unevenness . After a brief application of pressure, the exothermic reaction process of the nanomultilayer film is triggered. The invention also relates to a joint connection assembly.

Description

technical field [0001] The present invention relates to a conductive structure and an electrical connection member, in particular a solder base, for application, in particular printing, on glass substrates by applying soldered and unsoldered reactive (reaktiv) nano-multilayer films A method for forming a material-locked joint connection between the nano-multilayer film made of at least two exothermic reactive materials. The invention also relates to a material-bonded joint connection assembly. Background technique [0002] DE 10 2015 003 086 A1 discloses a method for shortening the process time when welding electrical or electronic components by means of electromagnetic induction heating. In this method, in particular, the electrical contact element is soldered to a solder connection surface applied to a non-metallic substrate, in particular a glass plate. [0003] According to the solution in this document, an electrical contact element designed as a solder base is reali...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/02B23K1/00H01R12/57
CPCB23K1/0008B23K1/0016H01R12/57H01R43/0207B23K1/19B23K2101/38B23K2103/172B23K2103/54B23K1/0006B23K35/001B23K35/0238B23K35/3033C03C27/04H01L2224/40137B23K2101/36
Inventor R·格莱斯贝格B·施奈德A·延里希
Owner FEW FAHRZEUGELEKTRIKWERK