Ultrasonic vibration assistance laser boring method and device

Abstract

The invention provides an ultrasonic vibration assistance laser boring method and device. The device comprises a power source, an ultrasonic generator, an ultrasonic vibration auxiliary device clamping unit, an ultrasonic vibration generation unit, a workpiece clamping unit and a laser generation unit; the power source is connected with the ultrasonic generator through a first electric wire, the ultrasonic generator is connected with the ultrasonic vibration generation unit through a second electric wire, a workpiece is mounted on the workpiece clamping unit, and when laser boring is carried out, ultrasonic vibration generated by the ultrasonic vibration generation unit can act on the workpiece in the direction perpendicular to the machining surface of the workpiece. A melting material ina hole can be discharged while laser boring is carried out, through the ultrasonic vibration assistance effect, removal of slag can be accelerated, the removal rate of the slag can be improved, the phenomenon that melt is solidified on the hole wall again to form a re-casting layer is reduced or avoided, meanwhile, ultrasonic vibration can obviously improve the hole wall surface quality, the laserboring quality can be improved, and the boring efficiency is improved.

Description

Technical field [0001] The invention relates to advanced laser manufacturing and processing, belonging to the field of laser manufacturing and processing, and in particular to an ultrasonic vibration assisted laser drilling method and device. Background technique [0002] With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, and traditional processing methods can no longer meet certain process requirements. Laser drilling is the earliest practical laser processing technology and one of the main application areas of laser processing. Laser drilling refers to the use of a pulsed laser beam to irradiate the surface of the workpiece. Because the energy density of the focused laser beam is extremely high, the temperature at the focal point will instantly reach thousands of degrees Celsius. The workpiece material will be rapidly melted under the action of this high temperature. , Vaporizati...

AI Technical Summary

Problems solved by technology

[0003] The current laser drilling uses the laser as the heat source to process the workpiece, and the light energy is converted into heat energy. After absorbing the heat energy, the material heats up and forms a molten pool on its surface, and the surface material is continuously melted and removed. The disadvantage of this method is: the material During the laser drilling process, it will go through a complex process of high temperature melting and cooling and condensation, and finally a recast layer will be formed on the micropore wall. Due to the recoil pressure, the melt in the hole will flow and splash, and the splashed melt will easily Adhesion to the small hole wall produces cracks and affects the shape of the inner wall of the hole

Images