Ultrasonic vibration assistance laser boring method and device
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU UNIV
- Publication Date
- 2018-03-13
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Abstract
Description
Technical field
[0001] The invention relates to advanced laser manufacturing and processing, belonging to the field of laser manufacturing and processing, and in particular to an ultrasonic vibration assisted laser drilling method and device. Background technique
[0002] With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, and traditional processing methods can no longer meet certain process requirements. Laser drilling is the earliest practical laser processing technology and one of the main application areas of laser processing. Laser drilling refers to the use of a pulsed laser beam to irradiate the surface of the workpiece. Because the energy density of the focused laser beam is extremely high, the temperature at the focal point will instantly reach thousands of degrees Celsius. The workpiece material will be rapidly melted under the action of this high temperature. , Vaporizati...