Dummy fill insertion method based on unified framework of sequential quadratic programming method

A technology of sequence quadratic programming and filling method, applied in special data processing applications, instruments, electrical digital data processing, etc., to achieve high-quality results

Active Publication Date: 2018-03-13
FUDAN UNIV
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Problems solved by technology

Based on this evaluation method, literature [14] proposed an improved dummy filling method based on integer linear programming, but because this method uses a linear approximation to the optimization objective, generally only a suboptimal filling scheme can be obtained

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  • Dummy fill insertion method based on unified framework of sequential quadratic programming method
  • Dummy fill insertion method based on unified framework of sequential quadratic programming method
  • Dummy fill insertion method based on unified framework of sequential quadratic programming method

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Embodiment Construction

[0093] In order to make the objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below through specific examples.

[0094] This experiment is to verify the effectiveness of the unified chemical mechanical polishing process dummy filling method without model simplification proposed by the present invention. The experimental test cases and scoring standards are all from the literature [13] experimental test layout information and its corresponding scoring parameters As shown in Table 1 [13].

[0095] Adopt the dummy cell filling method proposed by the present invention, at first need to divide the whole layout, in this implementation example, divide the grid side length a=20 μ m, the minimum dummy cell width w m =32nm, the smallest dummy area a m =4800nm 2 , the distance between the smallest dummy and dummy or signal line s m =32nm, initial total filling amount search step size d=0.005.

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Abstract

The invention belongs to the field of integrated circuit semiconductor manufacturing technology and relates to a dummy fill insertion method for a chemical mechanical polishing process. The dummy fillinsertion method is unified without model approximation, a sequential quadratic programming method is adopted to directly solve a dummy fill insertion problem, and therefore a high-quality dummy fillinsertion result can be obtained. In specific implementation, the method of estimating an overlapping area before determining a dummy position is proposed and used for improving optimization efficiency. Through the method, a complicated dummy fill insertion target can be optimized under bearable operating time, a high-quality dummy fill insertion scheme can be obtained, acceleration can be well performed through parallel computing, and the method is used for solving the dummy fill insertion problem of a large-scale layout.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit semiconductor manufacturing, and relates to a dummy element filling method in a chemical mechanical polishing process, in particular to a unified dummy element filling method without model approximation. In particular, it relates to a dummy filling method based on the unified framework of sequential quadratic programming (SQP). This method takes the filling quality measure proposed in Ref. [13] as the optimization objective and optimizes the dummy filling method. Background technique [0002] Chip surface planarization is one of the key links in the manufacture of integrated circuits, and the chemical mechanical polishing (Chemical Mechanical Polishing, CMP) process is the main method to achieve this goal. The flatness of the surface topography of the polished chip is closely related to the layout mode, especially the distribution of interconnection line density in the layout. Therefo...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/392
Inventor 曾璇严昌浩王胜国陶育东
Owner FUDAN UNIV
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