Substrate processing apparatus and substrate processing method

A substrate processing apparatus and technology for a substrate processing method are applied in the directions of cleaning methods and utensils, chemical instruments and methods, cleaning methods using liquids, etc., which can solve the problems of increased number of substrate processing steps and insufficient cleaning power, and achieve electrical attraction. The effect of strong force and shortening of the total processing time

Active Publication Date: 2018-03-13
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the cleaning in the substrate processing apparatus, the cleaning power may not be sufficient, and a substrate cleaning apparatus separate from the substrate processing apparatus is often used to clean the substrate.
In this way, there is a problem that the number of steps of substrate processing increases

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

Examples

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Embodiment Construction

[0084] Hereinafter, embodiments according to the present invention will be specifically described with reference to the drawings.

[0085] figure 1 It is an example which schematically shows the outline structure of a substrate processing apparatus, and can also be considered as a schematic plan view of a substrate processing apparatus. The substrate processing apparatus includes: a load port 1 ; one or more polishing units 2 ; a plurality of cleaning devices 31 to 33 ; one or more drying devices 4 ; transfer units 5 to 9 ; substrate stations 10 and 11 ; Each part other than the load port 1 can be accommodated in the device 13 .

[0086] The load port 1 is arranged adjacent to the short side of the device 13, and carries a substrate cassette storing a substrate such as a semiconductor wafer.

[0087] The grinding section 2 is arranged side by side along the long side of the device 13, and uses, for example, a 2 ) slurry to polish the substrate. Slurry remains on the ground...

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PUM

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Abstract

Provided is a substrate processing apparatus, the apparatus comprising: a polisher configured to polish a substrate using polishing liquid; a first cleaner configured to clean, using sulfuric acid andhydrogen peroxide water, the substrate polished by the polisher; a second cleaner configured to clean, using a basic chemical liquid and hydrogen peroxide water, the substrate cleaned by the first cleaner; and a drier configured to dry the substrate cleaned by the second cleaner. A substrate after being polished can be sufficiently cleaned with a small number of processes according to the substrate processing apparatus and the substrate processing method.

Description

technical field [0001] The invention relates to a substrate processing device and a substrate processing method. Background technique [0002] A substrate processing apparatus such as a CMP (Chemical Mechanical Polishing) apparatus polishes a substrate using a slurry, and thereafter cleans the substrate. However, the cleaning power in the substrate processing apparatus is not necessarily sufficient, and a substrate cleaning apparatus separate from the substrate processing apparatus is often used to clean the substrate. In this way, there is a problem that the number of steps of substrate processing increases. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2008-114183 [0006] Patent Document 2: Japanese Patent No. 3725809 [0007] The present invention has been made in view of such problems, and it is an object of the present invention to provide a substrate processing apparatus and a substrate processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67051C11D3/3947C11D7/06C11D7/08B24B5/35B24B57/02C11D11/0064B08B3/024B08B3/08B08B3/10C01B15/01C11D7/34
Inventor 今井正芳德重克彦小仓大渡边和英国泽淳次饭泉健宫崎充
Owner EBARA CORP
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