A method for preparing an ordered microgroove structure multilayer superabrasive electroplated grinding wheel
A technology of superabrasives and grinding wheels, which is applied in the direction of bonded grinding wheels, abrasives, grinding/polishing equipment, etc. It can solve the problems of increased fluctuations in the contact area between the grinding wheel and the workpiece, the decline in the surface quality of the vibrating workpiece, and the difficulty in controlling the shape of the abrasive group. , to achieve high structure and size consistency, improve processing quality, and improve the effect of chip holding
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[0028] The specific embodiments of the invention will be further described below in conjunction with the accompanying drawings.
[0029] see Figure 1 to Figure 6 , a multilayer superabrasive electroplated grinding wheel with an ordered microgroove structure, its structural feature is that a large number of electroplated superabrasive layers 8 containing multilayer superabrasives 3 are arranged on the outer circumference of the grinding wheel hub 1, Slanted microgrooves 12 are arranged between adjacent abrasive layers 8; the width of the microgrooves 12 is only 50 μm, the depth is 500 μm, the aspect ratio reaches 10, and the axial length is equal to the thickness of the grinding wheel; the microgrooves 12 are arrayed on the grinding wheel. They are arranged in an orderly manner at equal intervals on the working surface of the outer circumference, with a pitch of 700 μm. The ordered micro-groove structure greatly increases the chip-holding space of the grinding wheel, improves t...
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