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Support and detachment of flexible substrates

A flexible substrate, rigid technology, applied in the field of flexible substrate structure and manufacturing

Inactive Publication Date: 2018-04-03
ROYOLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been a challenge to properly control the adhesion force between the flexible substrate and the rigid carrier to facilitate mechanical separation, while still maintaining a sufficiently strong connection of the flexible substrate to the rigid carrier to support the display manufacturing process.

Method used

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  • Support and detachment of flexible substrates
  • Support and detachment of flexible substrates
  • Support and detachment of flexible substrates

Examples

Experimental program
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Effect test

Embodiment Construction

[0034] According to various embodiments of the present application, the flexible substrate is adhered to the rigid carrier in a sufficiently firm manner such that thin film transistor (TFT) devices and corresponding display devices can be fabricated on the flexible substrate supported by the rigid carrier. After forming the TFT devices and corresponding display devices, the flexible substrate needs to be separated from the rigid carrier without causing any damage to the TFT devices and corresponding display devices formed thereon. In some embodiments, the flexible substrate is adhered to the rigid carrier by one or more strong adhesive regions and one or more normal adhesive regions on the bottom surface of the flexible substrate in contact with the rigid carrier. The strong adhesive region and the normal adhesive region are adhered to the rigid support with different adhesive strengths, and are sequentially separated from the rigid support using different separation methods. ...

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Abstract

This application discloses a flexible substrate device that includes a flexible substrate and a plurality of electronic devices. The flexible substrate includes a top surface and a bottom surface opposite to the top surface, and the plurality of electronic devices formed on the top surface of the flexible substrate. The bottom surface further includes one or more strong adhesion regions and one ormore normal adhesion regions that are distinct from the one or more strong adhesion regions. Each of the one or more strong adhesion regions and the one or more normal adhesion regions are configuredto attach to a rigid carrier with first adhesion strength and second adhesion strength, respectively. The first adhesion strength is substantially larger than the second adhesion strength. In some embodiments, the flexible substrate device is a thin film transistor (TFT) device, and the plurality of electronic devices includes a TFT array.

Description

technical field [0001] The present application relates generally to flexible substrates for electronic devices, and in particular, to flexible substrate structures and fabrication methods that can effortlessly convert flexible substrates from rigid separated from the carrier. Background technique [0002] Thin and flexible electronic displays are of great value in wearable devices, e-newspapers, smart ID cards, and other consumer electronics. Such flexible electronic displays have been realized in active-matrix organic light-emitting diode (AMOLED) displays. Specifically, in an AMOLED display, a thin film transistor (TFT) device is fabricated on a flexible substrate by arranging a thin film of an active semiconductor layer together with an insulating dielectric layer and metal electrodes. The flexible substrate is temporarily attached to a rigid carrier that provides sufficient mechanical support for the flexible substrate during the process of equipping the TFT device and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L51/52H01L51/56H10K99/00
CPCH10K71/80H10K77/111H10K50/80H10K71/00Y02E10/549Y02P70/50H10K59/1201H10K2102/311H01L21/6836
Inventor 余晓军魏鹏袁泽刘自鸿
Owner ROYOLE