Automatic sample thinning method

Abstract

The invention relates to the technical field of semiconductors, in particular to an automatic sample thinning method. The method includes the steps of S1, providing an initial sample with a defect; S2, forming two grooves in the surface, avoiding the defect, of the initial sample, wherein two parallel extension lines of the two lateral edges of the defect serve as the initial lines, and the groovewidth extends to the two sides; S3, filling the two grooves with metal different from the initial sample; S4, thinning the two sides of the sample filled with metal through a focused ion beam technology, and monitoring particle components returning in the thinning process in real time in the thinning process; S5, stopping the thinning operation when it is monitored that the ratio of the differentmetal components in the particle components is lower than a preset value. The position of focused ion cutting can be precisely controlled, slicing precision is improved, the automation degree is high, efficiency is high, labor cost is low, and the sample preparation success rate is high.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, in particular to an automated sample thinning method. Background technique [0002] With the improvement of integrated circuit integration, the size of transistors in chips is getting smaller and smaller, and the minimum size of CD is also shrinking. The sensitivity of devices to tiny defects is gradually improved, and failure analysis methods face many challenges. [0003] Slicing using a focused ion beam defect inspection machine is a routine method for failure analysis. In the process of sample preparation, when encountering defects of small size, how to ensure that the core area can be cut is a major problem in the field. In the prior art, it is necessary to manually observe the cutting position while slicing, and the slicing position is very imprecise, and at the same time, the degree of automation is not high, the labor cost is high, and the efficiency is low. And it is not ...

AI Technical Summary

Problems solved by technology

In the existing technology, it is necessary to manually observe the cutting position while slicing, the slicing position is very inaccurate, and the degree of automation is not high, the labor cost is high, and the efficiency is low

Moreover, it is not easy to cut the defect to the center, and the probability of sample preparation failure is high

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