An automated method for sample thinning

Abstract

The present invention relates to the field of semiconductor technology, in particular to an automatic sample thinning method; including: step S1, providing an initial sample with a defect; step S2, forming two defects on the surface of the initial sample avoiding the defect The two parallel extension lines on the side edge are the starting lines, and the groove width extends to both sides of the two grooves; step S3, filling the two grooves with a metal different from the initial sample; step S4, using focused ion Beam technology thins both sides of the sample filled with metal, and monitors the returned particle composition in the thinning process in real time during the thinning process; step S5, the composition of the different metals in the monitored particle composition When the ratio is lower than a preset value, the thinning operation will be stopped; the cutting position of the focused ion can be precisely controlled, and the sectioning accuracy can be improved. At the same time, the degree of automation is high, the efficiency is high, the labor cost is low, and the success rate of sample preparation is high.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an automatic sample thinning method. Background technique [0002] With the improvement of integrated circuit integration, the size of transistors in the chip is getting smaller and smaller, and the minimum size of CD is also shrinking. The sensitivity of devices to tiny defects is gradually increasing, and failure analysis methods are facing many challenges. [0003] Slicing with a focused ion beam defect detector is a routine method for failure analysis. In the process of sample preparation, when encountering small-sized defects, how to ensure that the core area can be cut is a major problem in this field. In the existing technology, it is necessary to manually observe the cutting position while slicing. The slicing position is very inaccurate, and the degree of automation is not high. The labor cost is high and the efficiency is low. Moreover, it is not easy to cut the...

AI Technical Summary

Problems solved by technology

In the existing technology, it is necessary to manually observe the cutting position while slicing, the slicing position is very inaccurate, and the degree of automation is not high, the labor cost is high, and the efficiency is low

Moreover, it is not easy to cut the defect to the center, and the probability of sample preparation failure is high

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